10M02DCV36I7G Intel / Altera IC FPGA 27 I/O 36WLCSP

label:
2023/08/24 442

 
CATALOG
10M02DCV36I7G COUNTRY OF ORIGIN
10M02DCV36I7G PARAMETRIC INFO
10M02DCV36I7G PACKAGE INFO
10M02DCV36I7G MANUFACTURING INFO
10M02DCV36I7G ECAD MODELS

 
COUNTRY OF ORIGIN
Taiwan (Province of China)

 
PARAMETRIC INFO  
Device Logic Units 2000
Device Logic Cells 2000
Maximum Number of User I/Os 27
Device Number of DLLs/PLLs 2
Number of Multipliers 16 (18x18)
RAM Bits (Kbit) 108
Program Memory Type SRAM
Family Name MAX 10
Process Technology 55nm
Speed Grade 7
Dedicated DSP 16
Differential I/O Standards Supported LVDS|SSTL|HSUL
External Memory Interface DDR2 SDRAM|LPDDR2 SDRAM|DDR3 SDRAM|DDR3L SDRAM
Copy Protection No
Shift Registers Utilize Memory
Programmability Yes
In-System Programmability Yes
Reprogrammability Support Yes
Number of Global Clocks 20
Maximum Operating Supply Voltage (V) 1.25
I/O Voltage (V) 1.2|1.35|1.5|1.8|2.5|3|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Jun
Supplier Temperature Grade Industrial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 1.15
Typical Operating Supply Voltage (V) 1.2
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65

      
PACKAGE INFO
Supplier Package VBGA
Basic Package Type Ball Grid Array
Pin Count 36
Lead Shape Ball
PCB 36
Tab N/R
Pin Pitch (mm) 0.4
Package Length (mm) 3.47
Package Width (mm) 3.4
Package Height (mm) 0.33
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.46
Mounting Surface Mount
Package Weight (g) N/A
Package Description Wafer Level Chip Scale Package
Package Family Name BGA
Package Outline Link to Datasheet
 

MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) N/A
Reflow Solder Time (Sec) N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) N/A
Under Plating Material N/A
Terminal Base Material N/A
 

ECAD MODELS

 
Продукт RFQ