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| CATALOG |
| 3413.0223.22 COUNTRY OF ORIGIN |
| 3413.0223.22 PARAMETRIC INFO |
| 3413.0223.22 PACKAGE INFO |
| 3413.0223.22 MANUFACTURING INFO |
| 3413.0223.22 PACKAGING INFO |
| 3413.0223.22 ECAD MODELS |
| 3413.0223.22 APPLICATIONS |
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| COUNTRY OF ORIGIN |
| China |
| Switzerland |
|
| PARAMETRIC INFO |
| Typical Melting I2t (A²s) |
4.75 |
| Type |
Chip |
| Current Rating (A) |
5 |
| Voltage Rating (V) |
32 |
| Acting |
Fast |
| Maximum AC Voltage Rating (V) |
32 |
| Maximum DC Voltage Rating (V) |
63 |
| Application |
Circuits with Inrush|Industrial Electronic|Secondary Protection DC and AC |
| Fuse Material |
Glass |
| Fuse Size (mm) |
3.2 X 1.6 X 0.6 |
| Maximum Operating Temperature (°C) |
90 |
| Minimum Operating Temperature (°C) |
-55 |
| Typical Cold Resistance (Ohm) |
0.0096 |
| Minimum Storage Temperature (°C) |
0 |
| Maximum Storage Temperature (°C) |
60 |
|
| |
| PACKAGE INFO |
| Mounting |
Surface Mount |
| Package/Case |
1206 |
| Number of Terminals |
2 |
| Terminal Pitch (mm) |
N/R |
| Product Length (mm) |
3.2 |
| Product Depth (mm) |
1.6 |
| Product Height (mm) |
0.6 |
| Product Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
N/R |
| Termination Style |
Solder Pad |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
| Terminal Base Material |
N/A |
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| |
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Secondary Protection DC and AC |
| • Circuits with inrush |
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