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• Smallest amplified sensor package
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• Minimal PCB space
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• Fully signal conditioned
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• Operating temperature range from −45° to +125°C
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• Silicon piezoresistive technology
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• Monolithic design
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• 6 Pin DIP package
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• Port designed for O-ring interface
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• Excellent media compatibility
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• Accuracy of 0.2%
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CATALOG |
40PC150G2A COUNTRY OF ORIGIN
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40PC150G2A PARAMETRIC INFO
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40PC150G2A PACKAGE INFO
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40PC150G2A MANUFACTURING INFO
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40PC150G2A ECAD MODELS
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COUNTRY OF ORIGIN
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China
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PARAMETRIC INFO
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Device Pressure Type |
Gage |
Equivalent Overload Pressure Range (psi) |
100 to 500 |
Maximum Operating Supply Voltage (V) |
5 |
Maximum Operating Temperature (°C) |
125 |
Maximum Overload Pressure |
300psi |
Maximum Storage Temperature (°C) |
125 |
Maximum Supply Current (mA) |
10 |
Minimum Operating Supply Voltage (V) |
4.75 |
Minimum Operating Temperature (°C) |
-40 |
Minimum Storage Temperature (°C) |
-55 |
Operating Pressure Range |
0psi to 150psi |
Media |
Gas |
Typical Full Scale Output |
4.5VDC |
Typical Operating Supply Voltage (V) |
5 |
Accuracy (%) |
±2.5 |
Operating Supply Voltage (V) |
5(Max) |
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PACKAGE INFO
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Supplier Package |
DIP |
Basic Package Type |
Through Hole |
Pin Count |
6 |
Lead Shape |
Through Hole |
PCB |
6 |
Tab |
N/R |
Pin Pitch (mm) |
2.54 |
Package Length (mm) |
13.2 |
Package Width (mm) |
11.2 |
Package Height (mm) |
19.8 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
19.8 |
Mounting |
Through Hole |
Package Weight (g) |
N/A |
Package Material |
N/A |
Package Description |
Dual In Line Package |
Package Family Name |
DIP |
Jedec |
N/A |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
N/R |
Maximum Reflow Temperature (°C) |
N/R |
Reflow Solder Time (Sec) |
N/R |
Maximum Wave Temperature (°C) |
260 to 270 |
Wave Solder Time (Sec) |
5 |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
N/A |
Under Plating Material |
N/A |
Terminal Base Material |
N/A |
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ECAD MODELS |
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