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| CATALOG |
5035000991 COUNTRY OF ORIGIN
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5035000991 PARAMETRIC INFO
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5035000991 PACKAGE INFO
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5035000991 MANUFACTURING INFO
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5035000991 PACKAGING INFO
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5035000991 ECAD MODELS
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COUNTRY OF ORIGIN
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China
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Malaysia
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Japan
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PARAMETRIC INFO
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| Type |
SD Card |
| Gender |
SKT |
| Number of Contacts |
9 |
| Termination Method |
Solder |
| Tradename |
SD Card |
| Maximum Current Rating (A) |
0.5/Contact |
| Maximum Voltage Rating |
50VDC|50VAC |
| Maximum Insertion Force |
14N |
| Ejector Type |
Push-Push |
| Contact Material |
Copper Alloy |
| Contact Plating |
Gold Over Nickel |
| Housing Material |
Polymer |
| Insulation Resistance (MOhm) |
1000 |
| Maximum Contact Resistance (mOhm) |
100 |
| Number of Rows |
1 |
| Operating Temperature (°C) |
-25 to 85 |
| Minimum Operating Temperature (°C) |
-25 |
| Maximum Operating Temperature (°C) |
85 |
| Mating Cycle (Cycles) |
10000 |
| PCB Mounting Side |
Normal |
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PACKAGE INFO
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| Terminal Pitch (mm) |
2.5 |
| Body Orientation |
Right Angle |
| Mounting |
Surface Mount |
| Product Length (mm) |
28.6 |
| Product Depth (mm) |
27.8 |
| Product Height (mm) |
2.95 |
| Length Tolerance (mm) |
±0.25 |
| Depth Tolerance (mm) |
±0.25 |
| Height Tolerance (mm) |
±0.15 |
| Product Weight (g) |
1.547 |
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MANUFACTURING INFO
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| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
250 |
| Reflow Solder Time (Sec) |
N/A |
| Number of Reflow Cycle |
2 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
300 |
| Tape Width (mm) |
44 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
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ECAD MODELS
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