5CEBA4U15I7N Intel / Altera IC FPGA 176 I/O 324UBGA

label:
2024/03/5 321



CATALOG
5CEBA4U15I7N Country of Origin
5CEBA4U15I7N Parametric Info
5CEBA4U15I7N Package Info
5CEBA4U15I7N Manufacturing Info


COUNTRY OF ORIGIN
Korea (Republic of)


PARAMETRIC INFO
Device Logic Units 49000
Device Logic Cells 49000
Maximum Number of User I/Os 176
Device Number of DLLs/PLLs 4
Number of Multipliers 132 (18x18)
Maximum LVDS Data Rate (Mbps) 875
Maximum MLAB Capacity (Kbit) 303
Tradename Cyclone
Number of Registers 73920
RAM Bits (Kbit) 3080
Total Number of Block RAM 308
Program Memory Type SRAM
Family Name Cyclone® V E
Process Technology 28nm
Speed Grade 7
Dedicated DSP 66
Differential I/O Standards Supported LVPECL|LVDS
Single-Ended I/O Standards Supported LVTTL|LVCMOS
Ethernet MACs 2
JTAG Support (-) Yes
External Memory Interface DDR2 SDRAM|DDR3 SDRAM|LPDDR2
Copy Protection No
Shift Registers Utilize Memory
Programmability Yes
In-System Programmability Yes
Reprogrammability Support Yes
Number of Global Clocks 16
Maximum Operating Supply Voltage (V) 1.13
I/O Voltage (V) 1.2|1.25|1.35|1.5|1.8|2.5|3|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Jun
Supplier Temperature Grade Industrial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 1.07
Typical Operating Supply Voltage (V) 1.1
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package UBGA
Basic Package Type Ball Grid Array
Pin Count 324
Lead Shape Ball
PCB 324
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 15
Package Width (mm) 15
Package Height (mm) 0.95
Package Diameter (mm) N/R
Package Overall Length (mm) 15
Package Overall Width (mm) 15
Package Overall Height (mm) 1.35
Seated Plane Height (mm) 1.35
Mounting Surface Mount
Package Material Plastic
Package Description Ultra Fine Pitch Ball Grid Array
Package Family Name BGA
Jedec MO-216BAK-1
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/A

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