74AHCT125PW,118 Nexperia IC BUF NON-INVERT 5.5V 14TSSOP

label:
2025/04/9 19
74AHCT125PW,118 Nexperia IC BUF NON-INVERT 5.5V 14TSSOP


CATALOG
74AHCT125PW,118 COUNTRY OF ORIGIN
74AHCT125PW,118 PARAMETRIC INFO
74AHCT125PW,118 PACKAGE INFO
74AHCT125PW,118 MANUFACTURING INFO
74AHCT125PW,118 PACKAGING INFO


COUNTRY OF ORIGIN
China
Thailand


PARAMETRIC INFO
Process Technology CMOS
Logic Family AHCT
Logic Function Buffer/Line Driver
Input Signal Type Single-Ended
Output Type 3-State
Polarity Non-Inverting
Bus Hold No
Number of Elements per Chip 4
Number of Channels per Chip 4
Number of Output Enables per Chip 4 Low
Number of Input Enables per Chip 0
Number of Inputs per Chip 4
Number of Outputs per Chip 4
Minimum Operating Supply Voltage (V) 4.5
Maximum Operating Supply Voltage (V) 5.5
Typical Operating Supply Voltage (V) 5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Maximum Power Dissipation (mW) 500
Maximum Propagation Delay Time @ Maximum CL (ns) 7.5@4.5V to 5.5V
Absolute Propagation Delay Time (ns) 11
Propagation Delay Test Condition (pF) 50
Maximum High Level Output Current (mA) -8
Maximum Low Level Output Current (mA) 8
Maximum Quiescent Current (uA) 2


PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 14
Lead Shape Gull-wing
PCB 14
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 5.1(Max)
Package Width (mm) 4.5(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Shrink Small Outline Package
Package Family Name SO
Jedec MO-153
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix 118
Packaging Tape and Reel


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