74HC125D,653 Nexperia IC BUFFER NON-INVERT 6V 14SO

label:
2024/07/11 226

• Complies with JEDEC standard no. 7A
• Input levels:  The 74HC125: CMOS levels  The 74HCT125: TTL levels
• ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V
• Multiple package options
• Specified from 40 C to +85 C and from 40 C to +125 C
CATALOG
74HC125D,653 COUNTRY OF ORIGIN
74HC125D,653 PARAMETRIC INFO
74HC125D,653 PACKAGE INFO
74HC125D,653 MANUFACTURING INFO
74HC125D,653 PACKAGING INFO



COUNTRY OF ORIGIN
Thailand
China



PARAMETRIC INFO
Process Technology CMOS
Logic Family HC
Logic Function Buffer/Line Driver
Input Signal Type Single-Ended
Output Type 3-State
Polarity Non-Inverting
Bus Hold No
Number of Elements per Chip 4
Maximum Supply Current (mA) 70
Number of Channels per Chip 4
Number of Output Enables per Chip 4 Low
Number of Input Enables per Chip 0
Number of Inputs per Chip 4
Number of Outputs per Chip 4
Minimum Operating Supply Voltage (V) 2
Maximum Operating Supply Voltage (V) 6
Typical Operating Supply Voltage (V) 5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Maximum Power Dissipation (mW) 500
Maximum Propagation Delay Time @ Maximum CL (ns) 100@2V|20@4.5V|17@6V
Absolute Propagation Delay Time (ns) 190
Propagation Delay Test Condition (pF) 50
Maximum High Level Output Current (mA) -7.8
Maximum Low Level Output Current (mA) 7.8
Maximum Quiescent Current (uA) 8



PACKAGE INFO
Supplier Package SO
Basic Package Type Lead-Frame SMT
Pin Count 14
Lead Shape Gull-wing
PCB 14
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 8.75(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 8.75(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R



PACKAGING INFO
Packaging Document Link to Datasheet
 

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