74HC4051BQ,115 Nexperia IC MUX/DEMUX 8X1 16DHVQFN

label:
2025/04/8 32



• Wide analog input voltage range from -5 V to +5 V
• CMOS low power dissipation
• High noise immunity
• Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
• Logic level translation: to enable 5 V logic to communicate with ±5 V analog signals
• Typical ‘break before make’ built-in
• Multiple package options
• Specified from -40 °C to +85 °C and -40 °C to +125 °C


CATALOG
74HC4051BQ,115 COUNTRY OF ORIGIN
74HC4051BQ,115 PARAMETRIC INFO
74HC4051BQ,115 PACKAGE INFO
74HC4051BQ,115 MANUFACTURING INFO
74HC4051BQ,115 PACKAGING INFO
74HC4051BQ,115 APPLICATIONS


COUNTRY OF ORIGIN
China
Thailand


PARAMETRIC INFO
Type Analog Multiplexer
Number of Channels per Chip 1
Multiplexer Architecture 8:1
Maximum On Resistance Range (Ohm) 150 to 250
Configuration Single 8:1
Number of Inputs per Chip 8
Function General
Typical Off Leakage Current (nA) ±400
Typical Off Isolation (dB) -50
Latch-Up Proof No
Number of Outputs per Chip 1
Logic Family HC
Chip Enable Signals Yes
Maximum On Resistance (Ohm) 180@4.5V
Maximum Propagation Delay Bus to Bus (ns) 8@±4.5V|10@6V|12@4.5V|60@2V
Maximum Turn-On Time (ns) 345@2V
Maximum Turn-Off Time (ns) 290@2V
Maximum Power Dissipation (mW) 500
Input Signal Type Single
Output Signal Type Single
Propagation Delay Test Condition (pF) 50
Maximum Low Level Output Current (mA) 25
Maximum High Level Output Current (mA) 25
Maximum Frequency (25°C) @ Vcc (MHz) 170(Typ)@±2.25V|180(Typ)@±4.5V
Special Features Break-Before-Make
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
Power Supply Type Single|Dual
Minimum Single Supply Voltage (V) 2
Typical Single Supply Voltage (V) 5
Maximum Single Supply Voltage (V) 10
Minimum Dual Supply Voltage (V) ±1
Typical Dual Supply Voltage (V) ±2.5
Maximum Dual Supply Voltage (V) ±5
Maximum Supply Current (mA) 0.016@10V


PACKAGE INFO
Supplier Package DHVQFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 16
Lead Shape No Lead
PCB 16
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 3.6(Max)
Package Width (mm) 2.6(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Depopulated Heat Sink Very Thin Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Jedec MO-241
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) N/A
Under Plating Material NiPdAu
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix 115
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Reel Width (mm) 12
Tape Pitch (mm) 4
Tape Width (mm) 12
Feed Hole Pitch (mm) 4
Component Orientation Q1
Packaging Document Link to Datasheet


APPLICATIONS
• Analog multiplexing and demultiplexing
• Digital multiplexing and demultiplexing
• Signal gating
Продукт RFQ