74HC4066D Toshiba X34 PB-F 74HC CMOS LOGIC IC SERI

label:
2024/02/27 323



• Wide operating temperature range: Topr = -40 to 125 ℃(Note 1)
• Low power dissipation: ICC = 1.0µA (max) at VCC = 6.0 V, Ta = 25℃ 
• High noise immunity: VNIH = VNIL = 28 % VCC (min)
• Low ON resistance: RON = 50Ω (typ.) at VCC = 9.0 V, VI/O = VCC or GND
• High degree of linearity: THD = 0.05 % (typ.) at VCC = 4.5 V


CATALOG
74HC4066D COUNTRY OF ORIGIN
74HC4066D PARAMETRIC INFO
74HC4066D PACKAGE INFO
74HC4066D MANUFACTURING INFO
74HC4066D PACKAGING INFO
74HC4066D ECAD MODELS 


COUNTRY OF ORIGIN
Taiwan (Province of China)
Netherlands
Thailand
China
Philippines


PARAMETRIC INFO
Type Analog Switch
Number of Channels per Chip 4
Switch Architecture SPST
Polarity Non-Inverting
Maximum On Resistance Range (Ohm) 100 to 150
Configuration Quad SPST
Number of Inputs per Chip 4
Logic Family HC
Number of Outputs per Chip 4
Function General
Chip Enable Signals Yes
Maximum On Resistance (Ohm) 142@4.5V
Maximum Propagation Delay Bus to Bus (ns) 2(Typ)@9V|2(Typ)@6V|3(Typ)@4.5V|8(Typ)@2V
Maximum Turn-On Time (ns) 36(Typ)@2V
Maximum Turn-Off Time (ns) 44(Typ)@2V
Maximum Power Dissipation (mW) 500
Input Signal Type Single
Output Signal Type Single
Propagation Delay Test Condition (pF) 50
Maximum Low Level Output Current (mA) 25
Maximum High Level Output Current (mA) 25
Maximum Frequency (25°C) @ Vcc (MHz) 180(Typ)@4.5V|200(Typ)@9V
Switch Control Logic Active High
Switch Normal Position NO
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Power Supply Type Single
Minimum Single Supply Voltage (V) 2
Typical Single Supply Voltage (V) 5
Maximum Single Supply Voltage (V) 10
Maximum Supply Current (mA) 0.08@10V@-40C to 125C


PACKAGE INFO
Supplier Package SO
Pin Count 14
PCB 14
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 8.75(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.45(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Material Plastic
Package Family Name SO
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Document Link to Datasheet


ECAD MODELS



Продукт RFQ