AD5293BRUZ-50-RL7 Analog Devices IC DGTL POT 1024POS 50K 14TSSOP

label:
2023/09/11 289


• Single-channel, 1024-position resolution
• 20 kΩ, 50 kΩ, and 100 kΩ nominal resistance Calibrated 1% nominal resistor tolerance (resistor performance mode)  
• Rheostat mode temperature coefficient: 35 ppm/°C
• Voltage divider temperature coefficient: 5 ppm/°C
• Single-supply operation: 9 V to 33 V  
• Dual-supply operation: ±9 V to ±16.5 V
• SPI-compatible serial interface
• Wiper setting readback


CATALOG
AD5293BRUZ-50-RL7 COUNTRY OF ORIGIN
AD5293BRUZ-50-RL7 PARAMETRIC INFO
AD5293BRUZ-50-RL7 PACKAGE INFO
AD5293BRUZ-50-RL7 MANUFACTURING INFO
AD5293BRUZ-50-RL7 PACKAGING INFO
AD5293BRUZ-50-RL7 ECAD MODELS
AD5293BRUZ-50-RL7 FUNCTIONAL BLOCK DIAGRAM  
AD5293BRUZ-50-RL7 APPLICATIONS  


COUNTRY OF ORIGIN
Ireland
Philippines


PARAMETRIC INFO
Resistance Value (KOhm) 50
Number of Positions 1024
Number of Pot per Package 1
Memory Type Volatile
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Supplier Temperature Grade Extended Industrial
Power Supply Type Single|Dual
Maximum Dual Supply Voltage (V) ±16.5
Maximum Single Supply Voltage (V) 33
Maximum Supply Current (mA) 0.0001(Typ)
Minimum Dual Supply Voltage (V) ±9
Minimum Single Supply Voltage (V) 9
Typical Dual Supply Voltage (V) ±15
Typical Single Supply Voltage (V) 15
Control Interface Serial (4-Wire, SPI)
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
 

PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 14
Lead Shape Gull-wing
PCB 14
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 5
Package Width (mm) 4.4
Package Height (mm) 1
Package Diameter (mm) N/R
Package Overall Length (mm) 5
Package Overall Width (mm) 6.4
Package Overall Height (mm) 1.2(Max)
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Shrink Small Outline Package
Package Family Name SOP
Jedec MO-153AB-1
Package Outline Link to Datasheet
 

MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy
 

PACKAGING INFO
Packaging Suffix RL7
Packaging Tape and Reel
Quantity Of Packaging 1000
Reel Diameter (in) 7
Packaging Document Link to Datasheet
 

ECAD MODELS


FUNCTIONAL BLOCK DIAGRAM  


APPLICATIONS
• Mechanical potentiometer replacement  
• Instrumentation: gain and offset adjustment
• Programmable voltage-to-current conversion
• Programmable filters, delays, and time constants
• Programmable power supply
• Low resolution DAC replacements
• Sensor calibration


Продукт RFQ