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• Complete Front-End for Bridge Sensor
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• Onboard PGA with Gain of 64 or 128
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• Onboard Oscillator
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• 18-Bit Noise-Free Resolution
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• Selectable 10SPS or 80SPS Data Rates
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• Simple, Pin-Driven Control
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• Two-Wire Serial Digital Interface
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• Tiny 16-pin TSSOP Package
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• Supply Range: 2.7V to 5.3V
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• –40°C to +85°C Temperature Range
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CATALOG |
ADS1230IPWR COUNTRY OF ORIGIN
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ADS1230IPWR PARAMETRIC INFO
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ADS1230IPWR PACKAGE INFO
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ADS1230IPWR MANUFACTURING INFO
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ADS1230IPWR PACKAGING INFO
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ADS1230IPWR ECAD MODELS
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ADS1230IPWR APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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China
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Taiwan (Province of China)
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PARAMETRIC INFO
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Converter Type |
General Purpose |
Input Type |
Voltage |
Architecture |
Delta-Sigma |
Resolution |
20bit |
Number of ADCs |
1 |
Sampling Rate |
80sps |
Digital Interface Type |
Serial (2-Wire) |
Voltage Reference |
External |
Input Signal Type |
Single-Ended|Differential |
Polarity of Input Voltage |
Bipolar |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Integral Nonlinearity Error |
±10ppm(Typ) |
Sample and Hold |
No |
Number of Input Channels |
1 |
Single-Ended Input |
Yes |
Differential Input |
Yes |
Input Voltage |
±2.5V |
No Missing Codes (bit) |
20 |
Full Scale Error |
±0.8%FSR(Typ) |
Differential Nonlinearity |
±1LSB |
Voltage Supply Source |
Analog and Digital |
Minimum Single Supply Voltage (V) |
2.7 |
Typical Single Supply Voltage (V) |
5 |
Maximum Single Supply Voltage (V) |
5.3 |
Digital Supply Support |
Yes |
Typical Power Dissipation (mW) |
5 |
Maximum Power Dissipation (mW) |
7.7 |
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PACKAGE INFO
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Supplier Package |
TSSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
16 |
Lead Shape |
Gull-wing |
PCB |
16 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
5.1(Max) |
Package Width (mm) |
4.5(Max) |
Package Height (mm) |
1.05(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5.1(Max) |
Package Overall Width (mm) |
6.6(Max) |
Package Overall Height (mm) |
1.2(Max) |
Seated Plane Height (mm) |
1.2(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Thin Shrink Small Outline Package |
Package Family Name |
SO |
Jedec |
MO-153AB |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2000 |
Reel Diameter (in) |
13 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |

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APPLICATIONS
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• Weigh Scales
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• Strain Gauges
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• Pressure Sensors |
• Industrial Process Control |
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