ADS1230IPWR Texas Instruments 20-Bit Analog-to-Digital Converter For Bridge Sensors

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2024/09/11 188
ADS1230IPWR Texas Instruments 20-Bit Analog-to-Digital Converter For Bridge Sensors


• Complete Front-End for Bridge Sensor
• Onboard PGA with Gain of 64 or 128
• Onboard Oscillator
• 18-Bit Noise-Free Resolution
• Selectable 10SPS or 80SPS Data Rates
• Simple, Pin-Driven Control
• Two-Wire Serial Digital Interface
• Tiny 16-pin TSSOP Package
• Supply Range: 2.7V to 5.3V
• –40°C to +85°C Temperature Range


CATALOG
ADS1230IPWR COUNTRY OF ORIGIN
ADS1230IPWR PARAMETRIC INFO
ADS1230IPWR PACKAGE INFO
ADS1230IPWR MANUFACTURING INFO
ADS1230IPWR PACKAGING INFO
ADS1230IPWR ECAD MODELS
ADS1230IPWR APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
China
Taiwan (Province of China)


PARAMETRIC INFO
Converter Type General Purpose
Input Type Voltage
Architecture Delta-Sigma
Resolution 20bit
Number of ADCs 1
Sampling Rate 80sps
Digital Interface Type Serial (2-Wire)
Voltage Reference External
Input Signal Type Single-Ended|Differential
Polarity of Input Voltage Bipolar
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Integral Nonlinearity Error ±10ppm(Typ)
Sample and Hold No
Number of Input Channels 1
Single-Ended Input Yes
Differential Input Yes
Input Voltage ±2.5V
No Missing Codes (bit) 20
Full Scale Error ±0.8%FSR(Typ)
Differential Nonlinearity ±1LSB
Voltage Supply Source Analog and Digital
Minimum Single Supply Voltage (V) 2.7
Typical Single Supply Voltage (V) 5
Maximum Single Supply Voltage (V) 5.3
Digital Supply Support Yes
Typical Power Dissipation (mW) 5
Maximum Power Dissipation (mW) 7.7


PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 16
Lead Shape Gull-wing
PCB 16
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 5.1(Max)
Package Width (mm) 4.5(Max)
Package Height (mm) 1.05(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5.1(Max)
Package Overall Width (mm) 6.6(Max)
Package Overall Height (mm) 1.2(Max)
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Shrink Small Outline Package
Package Family Name SO
Jedec MO-153AB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2000
Reel Diameter (in) 13
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• Weigh Scales
• Strain Gauges
• Pressure Sensors
• Industrial Process Control
Продукт RFQ