AP6503SP-13 Diodes Incorporated IC REG BUCK ADJ 3A SYNC 8SO

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2024/09/6 181
AP6503SP-13 Diodes Incorporated IC REG BUCK ADJ 3A SYNC 8SO


• VIN 4.7V to 23V
• 3A Continuous Output Current at 12Vin and 3.3Vout, 5.5A Peak
• VOUT Adjustable to 0.925 to 20V
• 340kHz Switching Frequency
• Programmable Soft-Start
• Enable Pin
• Protection
• OCP
• Thermal Shutdown
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)


CATALOG
AP6503SP-13 COUNTRY OF ORIGIN
AP6503SP-13 LIFECYCLE
AP6503SP-13 PARAMETRIC INFO
AP6503SP-13 PACKAGE INFO
AP6503SP-13 MANUFACTURING INFO
AP6503SP-13 PACKAGING INFO
AP6503SP-13 APPLICATIONS


COUNTRY OF ORIGIN
China


LIFECYCLE
Obsolete
Jul 31,2023


PARAMETRIC INFO
Type Synchronous Step Down
Number of Outputs 1
Minimum Input Voltage (V) 4.7
Maximum Input Voltage (V) 23
Output Voltage (V) 0.925 to 20
Maximum Output Current (A) 4
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Switching Frequency (kHz) 380
Efficiency (%) 95
Switching Regulator Yes
Operating Supply Voltage (V) 4.75 to 23
Output Type Adjustable
Typical Quiescent Current (uA) 0.6
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier Package SO EP
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 4.95(Max)
Package Width (mm) 3.95(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Small Outline IC, Exposed Pad
Package Family Name SO
Jedec MS-012
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material N/A

 
PACKAGING INFO
Packaging Suffix 13
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Type Embossed


APPLICATIONS
• Gaming consoles
• Flat screen TV sets and monitors
• Set top boxes
• Distributed power systems
• Home audio
• Consumer electronics
• Network systems
• FPGA, DSP and ASIC supplies
• Green electronics
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