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CATALOG |
B2B-PH-K-S (LF)(SN) COUNTRY OF ORIGIN |
B2B-PH-K-S (LF)(SN) PARAMETRIC INFO
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B2B-PH-K-S (LF)(SN) PACKAGE INFO
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B2B-PH-K-S (LF)(SN) MANUFACTURING INFO
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B2B-PH-K-S (LF)(SN) PACKAGING INFO
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B2B-PH-K-S (LF)(SN) EACD MODELS
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COUNTRY OF ORIGIN |
Malaysia |
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PARAMETRIC INFO
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Type |
Shrouded Header (4 Sides) |
Gender |
HDR |
Number of Contacts |
2 |
Termination Method |
Solder |
Maximum Current Rating (A) |
2 |
Maximum Voltage Rating |
100VDC|100VAC |
Housing Material |
Polyamide 6/6 |
Housing Color |
White |
Contact Material |
Brass |
Contact Plating |
Tin Over Copper |
Number of Rows |
1 |
Maximum Contact Resistance (mOhm) |
20 |
Polarization Type |
Center Slot |
Wire Size (AWG) |
24-32 |
Insulation Resistance (MOhm) |
1000 |
Operating Temperature (°C) |
-25 to 85 |
Minimum Operating Temperature (°C) |
-25 |
Maximum Operating Temperature (°C) |
85 |
Maximum Terminal Width (mm) |
0.5(Typ) |
Tail Length (mm) |
3.4 |
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PACKAGE INFO
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Terminal Pitch (mm) |
2 |
Body Orientation |
Straight |
Mounting |
Through Hole |
Product Length (mm) |
5.9 |
Product Length (Ejector Open) (mm) |
N/R |
Product Depth (mm) |
4.5 |
Product Height (mm) |
6 |
Product Weight (g) |
N/A |
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MANUFACTURING INFO
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MSL |
N/R |
Maximum Reflow Temperature (°C) |
N/R |
Reflow Solder Time (Sec) |
N/R |
Number of Reflow Cycle |
N/R |
Standard |
N/R |
Maximum Wave Temperature (°C) |
N/A |
Wave Solder Time (Sec) |
N/A |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Sn |
Under Plating Material |
Cu |
Terminal Base Material |
Brass |
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PACKAGING INFO
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Packaging |
Box |
Quantity Of Packaging |
1000 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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