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• Small size |
• Fast response time |
• High current rating |
• Stable performance over life |
• Very low capacitance |
• High insulation resistance |
• Excellent SMD handling |
• RoHS-compatible |
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CATALOG |
B88069X6051T902 COUNTRY OF ORIGIN |
B88069X6051T902 LIFECYCLE |
B88069X6051T902 MANUFACTURING INFO |
B88069X6051T902 PACKAGING INFO |
B88069X6051T902 APPLICATIONS |
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COUNTRY OF ORIGIN |
China |
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LIFECYCLE |
Obsolete
Sep 20,2021 |
|
MANUFACTURING INFO |
MSL |
N/A |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 |
Number of Reflow Cycle |
3 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
260 |
Wave Solder Time (Sec) |
20 |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
N/A |
Number of Wave Cycles |
3 |
|
|
PACKAGING INFO |
Packaging Suffix |
T902 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
900 |
Packaging Document |
Link to Datasheet |
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APPLICATIONS |
• Modem |
• Data lines |
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