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• Low Forward Voltage Drop
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• Fast Switching
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• Ultra-Small Surface Mount Package
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• PN Junction Guard Ring for Transient and ESD Protection
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• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
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• Halogen and Antimony Free. “Green” Device (Note 3)
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• The DIODES™ BAS70DW-05Q is suitable for automotive applications requiring specific change control; this part is AEC-Q101 qualified, PPAP capable, and manufactured in IATF 16949 certified facilities.https://www.diodes.com/quality/product-definitions/
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• An Automotive-Compliant Part is Available Under Separate Datasheet (BAS70TWQ_BAS70DW-04Q)
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CATALOG |
BAS70BRW-7-F COUNTRY OF ORIGIN
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BAS70BRW-7-F PARAMETRIC INFO
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BAS70BRW-7-F PACKAGE INFO
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BAS70BRW-7-F MANUFACTURING INFO
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BAS70BRW-7-F PACKAGING INFO
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BAS70BRW-7-F ECAD MODELS
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BAS70BRW-7-F APPLICATIONS
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COUNTRY OF ORIGIN
|
China
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PARAMETRIC INFO
|
Type |
Schottky Diode |
Configuration |
Double Dual Series |
Peak Reverse Repetitive Voltage (V) |
70 |
Maximum DC Reverse Voltage (V) |
70 |
Maximum Continuous Forward Current (A) |
0.07 |
Maximum Power Dissipation (mW) |
200 |
Maximum Junction Ambient Thermal Resistance |
625°C/W |
Peak Forward Voltage (V) |
1@0.015A |
Peak Non-Repetitive Surge Current (A) |
0.1 |
Maximum RMS Reverse Voltage (V) |
49 |
Peak Reverse Current (uA) |
0.1@50V |
Peak Reverse Recovery Time (ns) |
5 |
Operating Junction Temperature (°C) |
-55 to 125 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
125 |
Maximum Diode Capacitance (pF) |
2 |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
125 |
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PACKAGE INFO
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Supplier Package |
SOT-363 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
6 |
Lead Shape |
Gull-wing |
PCB |
6 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
2.15 |
Package Width (mm) |
1.3 |
Package Height (mm) |
0.95 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
2.15 |
Package Overall Width (mm) |
2.1 |
Package Overall Height (mm) |
1 |
Seated Plane Height (mm) |
1 |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Jedec |
N/A |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Alloy 42 |
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PACKAGING INFO |
Packaging Suffix |
7 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
Reel Diameter (in) |
7 |
Reel Width (mm) |
8.4 |
Tape Pitch (mm) |
4 |
Tape Width (mm) |
8 |
Feed Hole Pitch (mm) |
4 |
Hole Center to Component Center (mm) |
2 |
Component Orientation |
Q3 |
Packaging Document |
Link to Datasheet |
Tape Type |
Embossed |
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ECAD MODELS |

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APPLICATIONS |
• Polarity protection diodes |
• Rail-to-rail data line protection for two data lines |
• Multiplexing circuits |
• High-efficiency, low-current bridge rectifier circuits |
• Re-circulating diodes |
• Switching diodes |
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