BAS70BRW-7-F Diodes Incorporated DIODE ARRAY SCHOTTKY 70V SOT363

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2024/08/23 183
BAS70BRW-7-F Diodes Incorporated DIODE ARRAY SCHOTTKY 70V SOT363


• Low Forward Voltage Drop
• Fast Switching
• Ultra-Small Surface Mount Package
• PN Junction Guard Ring for Transient and ESD Protection
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• The DIODES™ BAS70DW-05Q is suitable for automotive applications requiring specific change control; this part is AEC-Q101 qualified, PPAP capable, and manufactured in IATF 16949 certified facilities.https://www.diodes.com/quality/product-definitions/
• An Automotive-Compliant Part is Available Under Separate Datasheet (BAS70TWQ_BAS70DW-04Q)


CATALOG
BAS70BRW-7-F COUNTRY OF ORIGIN
BAS70BRW-7-F PARAMETRIC INFO
BAS70BRW-7-F PACKAGE INFO
BAS70BRW-7-F MANUFACTURING INFO
BAS70BRW-7-F PACKAGING INFO
BAS70BRW-7-F ECAD MODELS
BAS70BRW-7-F APPLICATIONS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Type Schottky Diode
Configuration Double Dual Series
Peak Reverse Repetitive Voltage (V) 70
Maximum DC Reverse Voltage (V) 70
Maximum Continuous Forward Current (A) 0.07
Maximum Power Dissipation (mW) 200
Maximum Junction Ambient Thermal Resistance 625°C/W
Peak Forward Voltage (V) 1@0.015A
Peak Non-Repetitive Surge Current (A) 0.1
Maximum RMS Reverse Voltage (V) 49
Peak Reverse Current (uA) 0.1@50V
Peak Reverse Recovery Time (ns) 5
Operating Junction Temperature (°C) -55 to 125
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 125
Maximum Diode Capacitance (pF) 2
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125


PACKAGE INFO
Supplier Package SOT-363
Basic Package Type Lead-Frame SMT
Pin Count 6
Lead Shape Gull-wing
PCB 6
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 2.15
Package Width (mm) 1.3
Package Height (mm) 0.95
Package Diameter (mm) N/R
Package Overall Length (mm) 2.15
Package Overall Width (mm) 2.1
Package Overall Height (mm) 1
Seated Plane Height (mm) 1
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Alloy 42


PACKAGING INFO
Packaging Suffix 7
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Reel Width (mm) 8.4
Tape Pitch (mm) 4
Tape Width (mm) 8
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Q3
Packaging Document Link to Datasheet
Tape Type Embossed

 
ECAD MODELS



APPLICATIONS
• Polarity protection diodes
• Rail-to-rail data line protection for two data lines
• Multiplexing circuits
• High-efficiency, low-current bridge rectifier circuits
• Re-circulating diodes
• Switching diodes
Продукт RFQ