BC846B,215 Nexperia TRANS NPN 65V 0.1A SOT23

label:

2024/07/8 165

• General-purpose transistors

• SMD plastic package

• Two different gain selections

CATALOG

BC846B,215 COUNTRY OF ORIGIN

BC846B,215 PARAMETRIC INFO

BC846B,215 PACKAGE INFO

BC846B,215 MANUFACTURING INFO

BC846B,215 PACKAGING INFO

BC846B,215 EACD MODELS

BC846B,215 APPLICATIONS

COUNTRY OF ORIGIN

China

PARAMETRIC INFO

Type	NPN
Configuration	Single
Maximum Collector-Emitter Voltage (V)	65
Maximum Collector Base Voltage (V)	80
Maximum Emitter Base Voltage (V)	6
Maximum DC Collector Current (A)	0.1
Minimum Transition Frequency (MHz)	100
Maximum Power Dissipation (mW)	250
Maximum Noise Figure (dB)	10
Maximum Emitter Cut-Off Current (nA)	100
Maximum Junction Ambient Thermal Resistance	500K/W
Typical Input Capacitance (pF)	11
Typical Output Capacitance (pF)	2
Operating Junction Temperature (°C)	150
Maximum Collector Cut-Off Current (nA)	15
Maximum Collector-Emitter Saturation Voltage (V)	0.2@0.5mA@10mA\|0.4@5mA@100mA
Maximum Base Emitter Saturation Voltage (V)	0.76(Typ)@0.5mA@10mA\|0.9(Typ)@5mA@100mA
Category	Bipolar Small Signal
Minimum DC Current Gain	200@2mA@5V
Number of Elements per Chip	1
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150
Minimum Operating Temperature (°C)	-65
Maximum Operating Temperature (°C)	150

Supplier Package	SOT-23
Basic Package Type	Lead-Frame SMT
Pin Count	3
Lead Shape	Gull-wing
PCB	3
Tab	N/R
Pin Pitch (mm)	0.95
Package Length (mm)	3(Max)
Package Width (mm)	1.4(Max)
Package Height (mm)	1(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	3(Max)
Package Overall Width (mm)	2.5(Max)
Package Overall Height (mm)	1.1(Max)
Seated Plane Height (mm)	1.1(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Small Outline Transistor
Package Family Name	SOT
Jedec	TO-236AB
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	N/A
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	260
Wave Solder Time (Sec)	10
Lead Finish(Plating)	Sn
Under Plating Material	CuAg
Terminal Base Material	FeNi Alloy
Shelf Life Period	4 Years
Shelf Life Condition	8°C to 45°C+25 % to 75 % RH
Number of Wave Cycles	1

Packaging Suffix	215
Packaging	Tape and Reel
Quantity Of Packaging	3000
Reel Diameter (in)	7
Reel Width (mm)	8
Tape Pitch (mm)	4
Tape Width (mm)	8
Feed Hole Pitch (mm)	4
Component Orientation	Q3
Packaging Document	Link to Datasheet

• General-purpose switching and amplification