BC847B Diotec Semiconductor TRANS NPN 45V 0.1A SOT-23

label:
2025/04/8 29
BC847B Diotec Semiconductor TRANS NPN 45V 0.1A SOT-23


• General-purpose transistors
• SMD plastic packages
• Three different gain selections


CATALOG
BC847B COUNTRY OF ORIGIN
BC847B PARAMETRIC INFO
BC847B PACKAGE INFO
BC847B MANUFACTURING INFO
BC847B PACKAGING INFO
BC847B APPLICATIONS


COUNTRY OF ORIGIN
China
Malaysia


PARAMETRIC INFO
Type NPN
Configuration Single
Maximum Collector-Emitter Voltage (V) 45
Maximum Collector Base Voltage (V) 50
Maximum Emitter Base Voltage (V) 6
Maximum Pulsed Collector Current (A) 0.2
Maximum DC Collector Current (A) 0.1
Minimum Transition Frequency (MHz) 100
Maximum Power Dissipation (mW) 250
Typical Output Capacitance (pF) 1.5(Max)
Maximum Noise Figure (dB) 10
Operating Junction Temperature (°C) 150
Maximum Emitter Cut-Off Current (nA) 100
Maximum Junction Ambient Thermal Resistance (°C/W) 500°C/W
Typical Input Capacitance (pF) 11
Collector Current for VCE Saturation (mA) 10|100
Maximum Collector Cut-Off Current (nA) 15
Maximum Collector-Emitter Saturation Voltage (V) 0.2@0.5mA@10mA|0.4@5mA@100mA
Maximum Base Emitter Saturation Voltage (V) 0.7(Typ)@0.5mA@10mA|0.9(Typ)@5mA@100mA
Category Bipolar Small Signal
Minimum DC Current Gain 200@2mA@5V
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -65
Maximum Operating Temperature (°C) 150
Supplier Temperature Grade Automotive


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 3
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3(Max)
Package Width (mm) 1.4(Max)
Package Height (mm) 1(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 3(Max)
Package Overall Width (mm) 2.5(Max)
Package Overall Height (mm) 1.1(Max)
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-236AB
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H 1
Minimum PACKAGE_DIMENSION_H N/A
Maximum PACKAGE_DIMENSION_L 3
Minimum PACKAGE_DIMENSION_L 2.8
Maximum PACKAGE_DIMENSION_W 1.4
Minimum PACKAGE_DIMENSION_W 1.2
Maximum Diameter N/R
Minimum Diameter N/R
Maximum Seated_Plane_Height 1.1
Minimum Seated_Plane_Height 0.9


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Lead Finish(Plating) Sn
Under Plating Material CuAg
Terminal Base Material FeNi Alloy
Number of Wave Cycles 1


PACKAGING INFO
Packaging Document Link to Datasheet


APPLICATIONS
• General-purpose switching and amplification

Продукт RFQ