BC848BLT1G onsemi TRANS NPN 30V 0.1A SOT23

label:
2024/05/23 216

• Moisture Sensitivity Level: 1
• ESD Rating − Human Body Model: > 4000 V ESD Rating − Machine Model: > 400 V
• S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
CATALOG
BC848BLT1G COUNTRY OF ORIGIN
BC848BLT1G PARAMETRIC INFO
BC848BLT1G PACKAGE INFO
BC848BLT1G MANUFACTURING INFO
BC848BLT1G PACKAGING INFO
BC848BLT1G EACD MODELS



COUNTRY OF ORIGIN
China



PARAMETRIC INFO
Type NPN
Configuration Single
Maximum Collector-Emitter Voltage (V) 30
Maximum Collector Base Voltage (V) 30
Maximum Emitter Base Voltage (V) 5
Maximum DC Collector Current (A) 0.1
Minimum Transition Frequency (MHz) 100
Material Si
Maximum Power Dissipation (mW) 300
Maximum Noise Figure (dB) 10
Maximum Junction Ambient Thermal Resistance 556°C/W
Typical Output Capacitance (pF) 4.5(Max)
Operating Junction Temperature (°C) -55 to 150
Maximum Collector Cut-Off Current (nA) 15
Maximum Collector-Emitter Saturation Voltage (V) 0.25@0.5mA@10mA|0.6@5mA@100mA
Maximum Base Emitter Saturation Voltage (V) 0.7(Typ)@0.5mA@10mA|0.9(Typ)@5mA@100mA
Category Bipolar Small Signal
Minimum DC Current Gain 200@2mA@5V
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150



PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 3
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 2.9
Package Width (mm) 1.3
Package Height (mm) 0.94
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.4
Package Overall Height (mm) 1
Seated Plane Height (mm) 1
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-236AB
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material CuFeNi
Number of Wave Cycles N/R



PACKAGING INFO
Packaging Suffix T1
Packaging Tape and Reel
Quantity Of Packaging 3000
Packaging Document Link to Datasheet



ECAD MODELS

Продукт RFQ