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| CATALOG |
C5750X7R2A475M230KA COUNTRY OF ORIGIN
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C5750X7R2A475M230KA PARAMETRIC INFO
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C5750X7R2A475M230KA PACKAGE INFO
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C5750X7R2A475M230KA MANUFACTURING INFO
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C5750X7R2A475M230KA PACKAGING INFO
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C5750X7R2A475M230KA ECAD MODELS
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COUNTRY OF ORIGIN
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Japan
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PARAMETRIC INFO
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| Capacitance Value |
4.7uF |
| Voltage |
100VDC |
| Tolerance |
20% |
| Dielectric |
X7R |
| Technology |
Standard |
| Maximum Operating Temperature (°C) |
125 |
| Case Style |
Ceramic Chip |
| Construction |
Flat |
| Microwave Application |
No |
| Operating Temperature (°C) |
-55 to 125 |
| Minimum Operating Temperature (°C) |
-55 |
| DC Rated Voltage (VDC) |
100 |
| Negative Capacitance Tolerance (%) |
-20 |
| Positive Capacitance Tolerance (%) |
20 |
| Maximum Dissipation Factor (%) |
3 |
| Polarity |
Non Polar |
| Fixed/Variable |
Fixed |
| Maximum Terminal Width (mm) |
5.4 |
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PACKAGE INFO
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| Package/Case |
2220 |
| Mounting |
Surface Mount |
| Termination Style |
Pad |
| Terminal Pitch (mm) |
N/R |
| Product Length (mm) |
5.7 |
| Product Depth (mm) |
5 |
| Product Height (mm) |
2.3 |
| Product Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
N/R |
| Product Weight (g) |
N/A |
| Number of Terminals |
2 |
| Size (mm) |
5.7 X 5 X 2.3 |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
N/A |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
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ECAD MODELS
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