C5750X7S2A106M230KB TDK CAP CER 10UF 100V X7S 2220

label:
2024/09/9 169
C5750X7S2A106M230KB TDK CAP CER 10UF 100V X7S 2220


CATALOG
C5750X7S2A106M230KB COUNTRY OF ORIGIN
C5750X7S2A106M230KB PARAMETRIC INFO
C5750X7S2A106M230KB PACKAGE INFO
C5750X7S2A106M230KB MANUFACTURING INFO
C5750X7S2A106M230KB PACKAGING INFO


COUNTRY OF ORIGIN
Japan


PARAMETRIC INFO
Capacitance Value 10uF
Voltage 100VDC
Tolerance 20%
Dielectric X7S
Technology Standard
Maximum Operating Temperature (°C) 125
Case Style Ceramic Chip
Construction Flat
Microwave Application No
Operating Temperature (°C) -55 to 125
Minimum Operating Temperature (°C) -55
DC Rated Voltage (VDC) 100
Negative Capacitance Tolerance (%) -20
Positive Capacitance Tolerance (%) 20
Maximum Dissipation Factor (%) 5
Polarity Non Polar
Special Features Middle Voltage
Test Frequency (Hz) 1K
Fixed/Variable Fixed
Maximum Terminal Width (mm) 5.4


PACKAGE INFO
Package/Case 2220
Mounting Surface Mount
Termination Style Pad
Terminal Pitch (mm) N/R
Product Length (mm) 5.7
Product Depth (mm) 5
Product Height (mm) 2.3
Product Diameter (mm) N/R
Seated Plane Height (mm) N/R
Product Weight (g) N/A
Length Tolerance (mm) ±0.4
Depth Tolerance (mm) ±0.4
Height Tolerance (mm) ±0.2
Diameter Tolerance (mm) N/R
Number of Terminals 2
Size (mm) 5.7 X 5 X 2.3
Maximum Product Length (mm) 6.1
Maximum Product Depth (mm) 5.4
Maximum Product Height (mm) 2.5


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 10
Number of Reflow Cycle N/A
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ni
Terminal Base Material Cu
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix K
Packaging Tape and Reel
Quantity Of Packaging 500
Reel Diameter (in) 7
Reel Width (mm) 13
Tape Pitch (mm) 8
Tape Width (mm) 12
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Packaging Document Link to Datasheet
Tape Material Plastic

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