DS1308U-33+T Analog Devices / Maxim Integrated IC RTC CLK/CALENDAR I2C 8-UMAX

label:
2024/11/18 112
DS1308U-33+T Analog Devices / Maxim Integrated  IC RTC CLK/CALENDAR I2C 8-UMAX


CATALOG
DS1308U-33+T COUNTRY OF ORIGIN
DS1308U-33+T PARAMETRIC INFO
DS1308U-33+T PACKAGE INFO
DS1308U-33+T MANUFACTURING INFO
DS1308U-33+T PACKAGING INFO
DS1308U-33+T ECAD MODELS


COUNTRY OF ORIGIN
Thailand


PARAMETRIC INFO
Date Format DW:DM:M:Y
Time Format HH:MM:SS
User RAM (byte) 56
Bus Type Serial (I2C)
Function Clock/Calendar
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Extended
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 125
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 5.5

 
PACKAGE INFO
Supplier Package uMAX
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 3.1(Max)
Package Width (mm) 3.1(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 3.1(Max)
Package Overall Width (mm) 5.03(Max)
Package Overall Height (mm) 1.1(Max)
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Micro Small Outline Package
Package Family Name SOP
Jedec MO-187AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu C7025
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 3000


ECAD MODELS
Продукт RFQ