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CATALOG |
DS1308U-33+T COUNTRY OF ORIGIN |
DS1308U-33+T PARAMETRIC INFO |
DS1308U-33+T PACKAGE INFO |
DS1308U-33+T MANUFACTURING INFO |
DS1308U-33+T PACKAGING INFO |
DS1308U-33+T ECAD MODELS |
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COUNTRY OF ORIGIN |
Thailand |
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PARAMETRIC INFO |
Date Format |
DW:DM:M:Y |
Time Format |
HH:MM:SS |
User RAM (byte) |
56 |
Bus Type |
Serial (I2C) |
Function |
Clock/Calendar |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Supplier Temperature Grade |
Extended |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
125 |
Minimum Operating Supply Voltage (V) |
3 |
Typical Operating Supply Voltage (V) |
3.3 |
Maximum Operating Supply Voltage (V) |
5.5 |
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PACKAGE INFO |
Supplier Package |
uMAX |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
3.1(Max) |
Package Width (mm) |
3.1(Max) |
Package Height (mm) |
0.95(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
3.1(Max) |
Package Overall Width (mm) |
5.03(Max) |
Package Overall Height (mm) |
1.1(Max) |
Seated Plane Height (mm) |
1.1(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Micro Small Outline Package |
Package Family Name |
SOP |
Jedec |
MO-187AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu C7025 |
Number of Wave Cycles |
N/R |
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PACKAGING INFO |
Packaging Suffix |
T |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
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ECAD MODELS |
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