DS90UB954TRGZRQ1 Texas Instruments DUAL FPD LINK DESERIALIZER HUB W

label:
2023/11/14 363


• AEC-Q100 qualified for automotive applications
   – Device temperature grade 2: –40℃ to +105℃ ambient operating temperature range
• Dual deserializer hub aggregates one or two active sensors over FPD-Link III interface
• Power-Over-Coax (PoC) compatible transceiver
• MIPI DPHY Version 1.2 / CSI-2 Version 1 .3 compliant
   – CSI-2 output ports
   – Supports 1, 2, 3, 4 data lanes
   – CSI-2 data rate scalable for 400 Mbps / 800 Mbps / 1.5 Gbps / 1.6 Gbps each data lane
   – Programmable data types
   – Four virtual channels – ECC and CRC generation
• 2x2 Output replication mode
• Ultra-low data and control path latency
• Supports single-ended coaxial or Shielded Twisted-Pair (STP) cable
• Adaptive receive equalization
• I2C with fast-mode plus up to 1 Mbps
• Flexible GPIOs for camera synchronization and diagnostics  
• Compatible with DS90UB935-Q1, DS90UB953- Q1, DS90UB933-Q1 and DS90UB913A-Q1 serializers
• Line fault detection and advanced diagnostics
• ISO 10605 and IEC 61000-4-2 ESD compliant


CATALOG
DS90UB954TRGZRQ1 COUNTRY OF ORIGIN
DS90UB954TRGZRQ1 PARAMETRIC INFO
DS90UB954TRGZRQ1 PACKAGE INFO
DS90UB954TRGZRQ1 MANUFACTURING INFO
DS90UB954TRGZRQ1 PACKAGING INFO
DS90UB954TRGZRQ1 ECAD MODELS
DS90UB954TRGZRQ1 FUNCTIONAL BLOCK DIAGRAM  
DS90UB954TRGZRQ1APPLICATIONS  


COUNTRY OF ORIGIN
Philippines


PARAMETRIC INFO
Function Deserializer
Number of Drivers 1
Number of Receivers 1
Input Signal Type LVCMOS
Transmission Data Rate (Mbps) 4160
Number of Elements per Chip 1
Minimum Operating Supply Voltage (V) 1.045|1.71
Typical Operating Supply Voltage (V) 1.1|1.8
Maximum Operating Supply Voltage (V) 1.155|1.89
Output Signal Type LVCMOS
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Supplier Temperature Grade Automotive
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
 
PACKAGE INFO
Supplier Package VQFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 48
Lead Shape No Lead
PCB 48
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 7.15(Max)
Package Width (mm) 7.15(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 7.15(Max)
Package Overall Width (mm) 7.15(Max)
Package Overall Height (mm) 1(Max)
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Thin Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Jedec MO-220
 
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2500
 
ECAD MODELS


FUNCTIONAL BLOCK DIAGRAM  


APPLICATIONS  
• Automotive ADAS
   – Rear View Cameras (RVC)
   – Surround View Systems (SVS)
   – Camera Monitor Systems (CMS)
   – Forward Vision Cameras (FC)
   – Driver Monitoring Systems (DMS)
   – Satellite RADAR, Time of Flight (ToF) and LIDAR Sensor Modules
• Security and Surveillance
• Industrial and Medical Imaging


Продукт RFQ