EE-SY1200 Omron Electronics SENSOR PHOTO ULTRA COMP SMD

label:

2023/12/8 322

CATALOG

EE-SY1200 COUNTRY OF ORIGIN

EE-SY1200 PARAMETRIC INFO

EE-SY1200 PACKAGE INFO

EE-SY1200 MANUFACTURING INFO

EE-SY1200 PACKAGING INFO

EE-SY1200 ECAD MODELS

COUNTRY OF ORIGIN

Japan

PARAMETRIC INFO

Type	Reflective
Number of Channels per Chip	1
Output Device	Phototransistor
Peak Wavelength (nm)	940
Maximum Forward Current (mA)	50
Maximum Reverse Voltage (V)	4
Maximum Collector Current (mA)	20
Maximum Collector-Emitter Voltage (V)	30
Maximum Rise Time (ns)	30000(Typ)
Maximum Fall Time (ns)	30000(Typ)
Maximum Power Dissipation (mW)	50
Minimum Operating Temperature (°C)	-25
Maximum Operating Temperature (°C)	85
Minimum Storage Temperature (°C)	-40
Maximum Storage Temperature (°C)	100

Supplier Package	N/A
Basic Package Type	Non-Lead-Frame SMT
Pin Count	4
Lead Shape	No Lead
PCB	4
Tab	N/R
Pin Pitch (mm)	2.2
Package Length (mm)	3.2
Package Width (mm)	1.9
Package Height (mm)	1.1
Package Diameter (mm)	N/R
Seated Plane Height (mm)	1.1
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	N/A
Package Description	Surface Mount Device
Package Family Name	N/A
Jedec	N/A

MANUFACTURING INFO

MSL	5
Maximum Reflow Temperature (°C)	240
Reflow Solder Time (Sec)	10
Number of Reflow Cycle	2
Standard	N/A
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Wave Temp. Source	Link to Datasheet
Lead Finish(Plating)	N/A
Under Plating Material	N/A
Terminal Base Material	N/A
Number of Wave Cycles	N/R

Packaging	Tape and Reel
Quantity Of Packaging	2000
Reel Diameter (in)	7.09
Reel Width (mm)	13
Tape Pitch (mm)	4
Tape Width (mm)	12
Feed Hole Pitch (mm)	4
Hole Center to Component Center (mm)	2
Packaging Document	Link to Datasheet