EM6M2T2R ROHM Semiconductor MOSFET N/P-CH 20V 0.2A EMT6

label:
2024/04/2 230



• Low on - resistance
• Small package(EMT6)
• Low voltage drive(1.2V drive)


CATALOG
EM6M2T2R COUNTRY OF ORIGIN
EM6M2T2R PARAMETRIC INFO
EM6M2T2R PACKAGE INFO
EM6M2T2R MANUFACTURING INFO
EM6M2T2R PACKAGING INFO
EM6M2T2R EACD MODELS
EM6M2T2R APPLICATIONS


COUNTRY OF ORIGIN
Korea (Republic of)
Thailand
Philippines
PARAMETRIC INFO
Channel Type N|P
Channel Mode Enhancement
Configuration Dual
Maximum Drain Source Voltage (V) 20
Material Si
Maximum Continuous Drain Current (A) 0.2
Maximum Absolute Continuous Drain Current (A) 0.2
Maximum Gate Source Voltage (V) ±8@N Channel|±10@P Channel
Maximum Drain Source Resistance (mOhm) 1000@4V@N Channel|1200@4.5V@P Channel
Maximum Power Dissipation (mW) 150
Category Small Signal
Typical Input Capacity @ Vds (pF) 25@10V@N Channel|115@10V@P Channel
Typical Turn-On Delay Time (ns) 5@N Channel|6@P Channel
Typical Turn-Off Delay Time (ns) 15@N Channel|17@P Channel
Typical Fall Time (ns) 10@N Channel|17@P Channel
Typical Rise Time (ns) 10@N Channel|4@P Channel
Number of Elements per Chip 2
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier packaging EMT
Basic package type Lead-Frame SMT
Number of pins 6
Pin shape Flat
PCB 6
ears N/R
Pin spacing (mm) 0.5
Package length (mm) 1.7(Max)
Package width (mm) 1.3(Max)
Package height (mm) 0.45(Max)
Package diameter (mm) N/R
Package Overall Length (mm) 1.7(Max)
Package Overall Width (mm) 1.7(Max)
Package Overall Height (mm) 0.55(Max)
Mounting surface height (mm) 0.55(Max)
Install Surface Mount
Package weight (g) not applicable
Packaging materials Plastic
Package series name SOT
Package outline Link to datasheet


MANUFACTURING INFO
MSL 1
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 10
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) 265
Wave soldering time (seconds) 10
Wave soldering temperature source Link to datasheet
Lead Finish(Plating) SnCu
Plating materials not applicable
Terminal Base Material not applicable


PACKAGING INFO
Packaging Suffix T2R
Package Tape and reel packaging
Packing quantity 8000


ECAD MODELS



APPLICATIONS
• Switching
Продукт RFQ