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• ESD / transient protection according to:- IEC61000-4-2 (ESD): ±18 kV (air) / ±15 kV (contact)- IEC61000-4-4 (EFT): ±2 kV / ±40 A (5/50 ns)- IEC61000-4-5 (Surge): ±5.5 A (8/20 μs)
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• Bi-directional maximum working voltage: VWM = ±5.5 V
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• Line capacitance: CL= 5.8 pF at f = 1 MHz
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• Clamping voltage: Vcl = 7.5 V at ITLP = 16 A with Rdyn = 0.10 Ω
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• Very low leakage current: IL= 1 nA
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• Small form factor SMD size 0201, low profile (0.58 x 0.28 x 0.15 mm³)
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| CATALOG |
ESD245B1W0201E6327XTSA1 COUNTRY OF ORIGIN
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ESD245B1W0201E6327XTSA1 PARAMETRIC INFO
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ESD245B1W0201E6327XTSA1 PACKAGE INFO
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ESD245B1W0201E6327XTSA1 MANUFACTURING INFO
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ESD245B1W0201E6327XTSA1 PACKAGING INFO
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ESD245B1W0201E6327XTSA1 APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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PARAMETRIC INFO
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| Type |
TVS |
| Direction Type |
Bi-Directional |
| Maximum Working Voltage (V) |
5.5 |
| Configuration |
Single |
| Capacitance Value (pF) |
5.8(Typ) |
| Maximum Clamping Voltage (V) |
9(Typ) |
| Maximum Leakage Current (uA) |
0.03 |
| Number of Elements per Chip |
1 |
| Peak Pulse Power Dissipation (W) |
44 |
| Maximum Peak Pulse Current (A) |
5.5 |
| Typical Trigger Voltage (V) |
6(Min) |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
WLL |
| Pin Count |
2 |
| PCB |
2 |
| Tab |
N/R |
| Package Length (mm) |
0.58 |
| Package Width (mm) |
0.28 |
| Package Height (mm) |
0.15 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd |
| Terminal Base Material |
NiP |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
15000 |
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APPLICATIONS
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• Keypads, touchpads, buttons, convenience keys, LCD displays, cameras, audio lines
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• Mobile communication, notebooks, tablets, desktop computers, modules (WIFI, fingerprint, flash)
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