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• Very low profile - typical height of 1.0 mm
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• Ideal for automated placement
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• Glass passivated pellet chip junction
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• Ultrafast recovery times for high frequency |
• Low forward voltage drop, low power losses |
• Low thermal resistance |
• Meets MSL level 1 per J-STD-020, LF maximum peak of 260 °C |
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CATALOG |
ESH2PD-M3/84A COUNTRY OF ORIGIN |
ESH2PD-M3/84A PARAMETRIC INFO
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ESH2PD-M3/84A PACKAGE INFO
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ESH2PD-M3/84A MANUFACTURING INFO
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ESH2PD-M3/84A PACKAGING INFO
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ESH2PD-M3/84A APPLICATIONS |
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COUNTRY OF ORIGIN |
China |
Taiwan (Province of China) |
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PARAMETRIC INFO
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Type |
Switching Diode |
Configuration |
Single |
Peak Reverse Repetitive Voltage (V) |
200 |
Maximum Continuous Forward Current (A) |
2 |
Speed |
Ultra Fast Recovery Rectifier |
Peak Forward Voltage (V) |
0.98 |
Peak Non-Repetitive Surge Current (A) |
50 |
Peak Reverse Current (uA) |
1 |
Peak Reverse Recovery Time (ns) |
25 |
Operating Junction Temperature (°C) |
-55 to 175 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
175 |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
175 |
Supplier Temperature Grade |
Commercial |
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PACKAGE INFO
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Supplier Package |
SMP |
Pin Count |
2 |
PCB |
2 |
Tab |
N/R |
Package Length (mm) |
3.61(Max) |
Package Width (mm) |
2.18(Max) |
Package Height (mm) |
1.15(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1.15(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu |
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PACKAGING INFO
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Packaging Suffix |
/84A |
Packaging |
Tape and Reel |
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APPLICATIONS |
• For use in secondary rectification and freewheeling for
ultrafast switching speeds of AC/DC and DC/DC converters
in high temperature for both consumer and automotive
applications. |
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