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• Low Noise Figure: 10 dB
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• High linearity: In-Band Output IP3 > +30 dBm In-Band Output IP2 > +60 dBm
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• Pre-programmed and/or Programmable Bandwidth: 5 MHz to 72 MHz. (Please see HMC1023LP5E Ordering Information)
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• Exceptional 3 dB Bandwidth Accuracy: ±2.5%
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• Programmable Gain: 0 or 10 dB
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• Integrated ADC Driver Amplifier
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• 6th order Butterworth Magnitude & Phase Response
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• Automatic Filter Calibration
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• Externally Controlled Common Mode Output Level
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• Filter Bypass Option
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• Pin & Register Compatible to HMC900LP5E
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CATALOG |
HMC1023LP5E COUNTRY OF ORIGIN
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HMC1023LP5E LIFECYCLE |
HMC1023LP5E PARAMETRIC INFO
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HMC1023LP5E PACKAGE INFO
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HMC1023LP5E MANUFACTURING INFO
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HMC1023LP5E PACKAGING INFO
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HMC1023LP5E ECAD MODELS
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HMC1023LP5E FUNCTIONAL DIAGRAM
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HMC1023LP5E APPLICATIONS
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COUNTRY OF ORIGIN
|
Malaysia
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LIFECYCLE |
Obsolete
Aug 31,2022 |
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PARAMETRIC INFO
|
Type |
Low Pass Filter |
Number of Circuits |
2 |
Cut-Off Frequency Range |
>=6MHz |
Maximum Order |
6th |
Cut-Off Frequency |
72MHz(Max) |
Power Supply Type |
Single |
Operating Supply Voltage (V) |
5 |
Minimum Single Supply Voltage (V) |
4.75 |
Typical Single Supply Voltage (V) |
5 |
Maximum Single Supply Voltage (V) |
5.25 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
Supplier Package |
QFN EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
32 |
Lead Shape |
No Lead |
PCB |
32 |
Tab |
N/R |
Pin Pitch (mm) |
0.56(Max) |
Package Length (mm) |
5.1(Max) |
Package Width (mm) |
5.1(Max) |
Package Height (mm) |
0.95(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Quad Flat No Lead Package, Exposed Pad |
Package Family Name |
QFN |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
40 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
Ag |
Terminal Base Material |
Cu Alloy |
|
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PACKAGING INFO
|
Packaging |
Tape and Reel |
Quantity Of Packaging |
500 |
|
|
ECAD MODELS |
|
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FUNCTIONAL DIAGRAM |
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APPLICATIONS |
• Baseband filtering before or after data converters for point-to-point fixed wireless and cellular infrastructure transceivers |
• Software defined radio applications |
• Anti-aliasing and reconstruction filters |
• Test and measurement equipment |
• ADC driver applications |
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