HMC1023LP5E Analog Devices IC LOW PASS FILTER 72MHZ 32SMD

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2024/07/26 217
HMC1023LP5E Analog Devices IC LOW PASS FILTER 72MHZ 32SMD


• Low Noise Figure: 10 dB
• High linearity: In-Band Output IP3 > +30 dBm In-Band Output IP2 > +60 dBm
• Pre-programmed and/or Programmable Bandwidth: 5 MHz to 72 MHz. (Please see HMC1023LP5E Ordering Information)
• Exceptional 3 dB Bandwidth Accuracy: ±2.5%
• Programmable Gain: 0 or 10 dB
• Integrated ADC Driver Amplifier
• 6th order Butterworth Magnitude & Phase Response
• Automatic Filter Calibration
• Externally Controlled Common Mode Output Level
• Filter Bypass Option
• Pin & Register Compatible to HMC900LP5E


CATALOG
HMC1023LP5E COUNTRY OF ORIGIN
HMC1023LP5E LIFECYCLE
HMC1023LP5E PARAMETRIC INFO
HMC1023LP5E PACKAGE INFO
HMC1023LP5E MANUFACTURING INFO
HMC1023LP5E PACKAGING INFO
HMC1023LP5E ECAD MODELS
HMC1023LP5E FUNCTIONAL DIAGRAM
HMC1023LP5E APPLICATIONS 


COUNTRY OF ORIGIN
Malaysia


LIFECYCLE
Obsolete
Aug 31,2022


PARAMETRIC INFO
Type Low Pass Filter
Number of Circuits 2
Cut-Off Frequency Range >=6MHz
Maximum Order 6th
Cut-Off Frequency 72MHz(Max)
Power Supply Type Single
Operating Supply Voltage (V) 5
Minimum Single Supply Voltage (V) 4.75
Typical Single Supply Voltage (V) 5
Maximum Single Supply Voltage (V) 5.25
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier Package QFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 32
Lead Shape No Lead
PCB 32
Tab N/R
Pin Pitch (mm) 0.56(Max)
Package Length (mm) 5.1(Max)
Package Width (mm) 5.1(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 40
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 500

 
ECAD MODELS


FUNCTIONAL DIAGRAM


APPLICATIONS 
• Baseband filtering before or after data converters for point-to-point fixed wireless and cellular infrastructure transceivers
• Software defined radio applications
• Anti-aliasing and reconstruction filters
• Test and measurement equipment
• ADC driver applications
Продукт RFQ