HMC444LP4E Analog Devices IC MULTIPLIER X8 ACTIVE 24SMD

label:
2023/12/22 295


• Output Power: +6 dBm  
• Sub-Harmonic Suppression: >25 dBc
• SSB Phase Noise: -136 dBc/Hz
• Single Supply: +5V@ 68 mA
• 24 Lead 4x4 mm SMT Package: 16 mm2


CATALOG
HMC444LP4E COUNTRY OF ORIGIN
HMC444LP4E PARAMETRIC INFO
HMC444LP4E PACKAGE INFO
HMC444LP4E MANUFACTURING INFO
HMC444LP4E PACKAGING INFO
HMC444LP4E ECAD MODELS
HMC444LP4E APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
Korea (Republic of)


PARAMETRIC INFO
Frequency Multiplier Type Active
Multiplying Factor x8
Input Frequency Range (GHz) 1.2375 to 1.4
Output Frequency Range (GHz) 9.9 to 11.2
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Typical Output Power (dBm) 6
Maximum Input Power 5dBm
Typical Input Return Loss (dB) 22
Typical Output Return Loss (dB) 7
Minimum Operating Supply Voltage (V) 4.5
Typical Operating Supply Voltage (V) 5
Maximum Operating Supply Voltage (V) 5.5
Maximum Supply Current (mA) 91
Typical Phase Noise (dBc/Hz) -136
Maximum Power Dissipation (mW) 650
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
 
PACKAGE INFO
Supplier Package LFCSP EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 24
Lead Shape No Lead
PCB 24
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 4
Package Width (mm) 4
Package Height (mm) 0.88
Package Diameter (mm) N/R
Package Overall Length (mm) 4
Package Overall Width (mm) 4
Package Overall Height (mm) 0.9
Seated Plane Height (mm) 0.9
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Lead Frame Chip Scale Package, Exposed Pad
Package Family Name CSP
Jedec MO-220VGGD-8
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 500
 
ECAD MODELS


APPLICATIONS
• Active Multiplier for X Band Applications:
• Fiber Optic
• Point-to-Point Radios
• Military Radar

Продукт RFQ