HMC564LC4TR Analog Devices IC RF AMP GP 7GHZ-14GHZ 24QFN

label:
2023/11/23 293


• Noise Figure: 1.8 dB
• Gain: 17 dB
• OIP3: 25 dBm
• Single Supply: +3V @ 51 mA
• 50 Ohm Matched Input/Output
• RoHS Compliant 4 x 4 mm Package


CATALOG
HMC564LC4TR COUNTRY OF ORIGIN
HMC564LC4TR PARAMETRIC INFO
HMC564LC4TR PACKAGE INFO
HMC564LC4TR MANUFACTURING INFO
HMC564LC4TR PACKAGING INFO
HMC564LC4TR FUNCTIONAL BLOCK DIAGRAM
HMC564LC4TR APPLICATIONS


COUNTRY OF ORIGIN
France


PARAMETRIC INFO
Manufacturer Type Low Noise Amplifier
Number of Channels per Chip 1
Typical Power Gain (dB) 17@14000MHz
Typical Noise Figure (dB) 1.8@14000MHz
Operational Bias Conditions 3V/51mA
Typical Output 1dB Compressed Power @ Bias Conditions (dBm) 13
Typical 3rd Order Output Intercept Point @ Bias Conditions (dBm) 25
Process Technology pHEMT
Typical Output Intercept Point (dBm) 25@14000MHz
Maximum Power Dissipation (mW) 1160
Minimum Operating Frequency (MHz) 7000
Maximum Operating Frequency (MHz) 14000
Typical Output Power (dBm) 13@14000MHz
Typical Output Power Range (dBm) 10 to 15
Maximum Input Return Loss (dB) 15(Typ)@14000MHz
Maximum Output Return Loss (dB) 14(Typ)@14000MHz
Power Supply Type Dual
Typical Dual Supply Voltage (V) 3
Maximum Dual Supply Voltage (V) 3.5
Maximum Operating Supply Voltage (V) 3.5
Maximum Supply Current (mA) 75@3V
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
 
PACKAGE INFO
Supplier Package CLLCC EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 24
Lead Shape No Lead
PCB 24
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 3.9
Package Width (mm) 3.9
Package Height (mm) 0.9
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.9
Mounting Surface Mount
Package Weight (g) N/A
Package Material Ceramic
Package Description Ceramic Leadless Chip Carrier, Exposed Pad
Package Family Name LLCC
Jedec N/A
 
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Ni
Terminal Base Material W
Number of Wave Cycles N/R
 
PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 100
Reel Diameter (in) 13
 
FUNCTIONAL BLOCK DIAGRAM


APPLICATIONS
• Point-to-Point Radios
• Point-to-Multi-Point Radios & VSAT
• Test Equipment and Sensors
• Military & Space


Продукт RFQ