HMC8193LC4TR Analog Devices MIXERS

label:
2024/09/6 189
HMC8193LC4TR Analog Devices 	MIXERS


• Passive I/Q mixer
• RF and LO range: 2.5 GHz to 8.5 GHz
• Wide IF range: dc to 4 GHz
• Single-ended RF, LO, and IF
• Conversion loss (downconverter): 9 dB (typical)
• Image rejection (downconverter): 25 dBc (typical)
• SSB noise figure (downconverter): 11.5 dB (typical)
• Input IP3 (downconverter): 20 dBm (typical)
• Input P1dB compression point (downconverter): 13 dBm (typical)
• Input IP2 (downconverter): 58 dBm (typical)


CATALOG
HMC8193LC4TR COUNTRY OF ORIGIN
HMC8193LC4TR PARAMETRIC INFO
HMC8193LC4TR PACKAGE INFO
HMC8193LC4TR MANUFACTURING INFO
HMC8193LC4TR PACKAGING INFO
HMC8193LC4TR ECAD MODELS
HMC8193LC4TR FUNCTIONAL BLOCK DIAGRAM
HMC8193LC4TR APPLICATIONS


COUNTRY OF ORIGIN
United States of America


PARAMETRIC INFO
Maximum Input Frequency (MHz) 8500
Maximum Output Frequency (MHz) 3500
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Input Frequency (MHz) 2500
Minimum Output Frequency (MHz) 0
Maximum Conversion Loss (dB) 10
Typical Third Order Input Intercept Point (dBm) 21
Typical LO/RF Isolation (dB) 45
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier Package CLLCC EP
Pin Count 24
PCB 24
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 3.9
Package Width (mm) 3.9
Package Height (mm) 0.9
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.9
Mounting Surface Mount
Package Material Ceramic
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Lead Finish(Plating) Au
Under Plating Material Ni


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 100


ECAD MODELS



FUNCTIONAL BLOCK DIAGRAM



APPLICATIONS
• Test and measurement instrumentation
• Military, aerospace, and radar
• Direct conversion receivers

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