L5973D013TR STMicroelectronics IC REG BUCK ADJ 2.5A 8SOIC

label:
2024/03/6 212



■ 2.5 A internal switch
■ Operating input voltage from 4 V to 36 V
■ 3.3 V / (±2%) reference voltage
■ Output voltage adjustable from 1.235 V to 35 V
■ Low dropout operation: 100 % duty cycle
■ 250 kHz internally fixed frequency
■ Voltage feedforward
■ Zero load current operation
■ Internal current limiting
■ Inhibit for zero current consumption
■ Synchronization
■ Protection against feedback disconnection
■ Thermal shutdown


CATALOG
L5973D013TR Country of Origin
L5973D013TR Parametric Info
L5973D013TR Package Info
L5973D013TR  Manufacturing Info
L5973D013TR Packaging Info
L5973D013TR ECAD Models
L5973D013TR Applications


COUNTRY OF ORIGIN
Philippines
Thailand
China


PARAMETRIC INFO
Type Synchronous Step Down
Number of Outputs 1
Minimum Input Voltage (V) 4
Maximum Input Voltage (V) 36
Output Voltage (V) 1.235 to 35
Maximum Output Current (A) 2.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 150
Regulation Condition Change In Load 5mA
Regulation Condition Change In Line 31.6V
Switching Frequency (kHz) 275
Efficiency (%) 90(Typ)
Switching Regulator Yes
Operating Supply Voltage (V) 4 to 36
Output Type Adjustable
Load Regulation 15mV
Line Regulation 10mV
Typical Quiescent Current (uA) 3000
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Typical Switch Current (A) 3(Max)


PACKAGE INFO
Supplier Package HSOP EP
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 4.9
Package Width (mm) 3.9
Package Height (mm) 1.25(Min)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.7(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Heat Sinked Small Outline Package, Exposed Pad
Package Family Name SO
Jedec N/A


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn
Under Plating Material Ag
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Packaging Document Link to Datasheet


ECAD MODELS



Applications
■ Consumer: STB, DVD, TV, VCR, car radio,LCD monitors
■ Networking: XDSL, modems, DC-DC modules
■ Computer: printers, audio/graphic cards,optical storage, hard disk drive
■ Industrial: changers, car battery, DC-DCconverters


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