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• SOT-23 AEC Q-100 Grades 1 and 3 Available
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• Small Packages: SOT-23, TO-92, and SC70
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• No Output Capacitor Required
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• Tolerates Capacitive Loads |
• Fixed Reverse Breakdown Voltages of 2.048 V, 2.5 V, 3 V, 4.096 V, 5 V, 8.192 V, and 10 V |
• Key Specifications (2.5-V LM4040-N)– Output Voltage Tolerance (A Grade, 25°C):±0.1% (Maximum)– Low Output Noise (10 Hz to 10 kHz): 35 μVrms
(Typical)– Wide Operating Current Range: 60 μA to 15mA– Industrial Temperature Range: −40°C to +85°C– Extended Temperature Range: −40°C to
+125°C– Low Temperature Coefficient: 100 ppm/°C(Maximum) |
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CATALOG |
LM4040AIM3-4.1/NOPB COUNTRY OF ORIGIN |
LM4040AIM3-4.1/NOPB PARAMETRIC INFO
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LM4040AIM3-4.1/NOPB PACKAGE INFO
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LM4040AIM3-4.1/NOPB MANUFACTURING INFO
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LM4040AIM3-4.1/NOPB PACKAGING INFO
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LM4040AIM3-4.1/NOPB EACD MODELS
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LM4040AIM3-4.1/NOPB APPLICATIONS |
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COUNTRY OF ORIGIN |
China |
Philippines |
Malaysia |
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PARAMETRIC INFO
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Topology |
Shunt |
Reference Type |
Precision |
Output Voltage (V) |
4.096 |
Initial Accuracy |
0.1% |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Supplier Temperature Grade |
Industrial |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
Load Regulation |
3mV(Typ) |
Regulation Condition Change In Load |
14mA |
Maximum Output Current (mA) |
15 |
Maximum Temperature Coefficient |
30ppm/°C(Typ) |
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PACKAGE INFO
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Supplier Package |
SOT-23 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
3 |
Lead Shape |
Gull-wing |
PCB |
3 |
Tab |
N/R |
Pin Pitch (mm) |
0.95 |
Package Length (mm) |
3.04(Max) |
Package Width (mm) |
1.4(Max) |
Package Height (mm) |
0.95 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
3.04(Max) |
Package Overall Width (mm) |
2.64(Max) |
Package Overall Height (mm) |
1.12(Max) |
Seated Plane Height (mm) |
1.12(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Jedec |
TO-236 |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
Reel Diameter (in) |
7 |
Reel Width (mm) |
8.4 |
Tape Pitch (mm) |
4 |
Tape Width (mm) |
8 |
Component Orientation |
Q3 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS |
• Portable, Battery-Powered Equipment |
• Data Acquisition Systems |
• Instrumentation |
• Process Controls |
• Energy Management |
• Product Testing |
• Automotives |
• Precision Audio Components |
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