LM6134BIMX/NOPB Texas Instruments IC OPAMP GP 11MHZ RRO 14SOIC

label:
2023/10/13 351



• (For 5V Supply, Typ Unless Noted)  
• Rail-to-Rail Input CMVR −0.25 V to 5.25 V
• Rail-to-Rail Output Swing 0.01V to 4.99V
• High Gain-Bandwidth, 10 MHz at 20 kHz  
• Slew Rate 12 V/μs
• Low Supply Current 360 μA/Amp
• Wide Supply Range 2.7 V to over 24 V
• CMRR 100 dB
• Gain 100 dB with R r = 10 k
• PSRR 82 dB


CATALOG
LM6134BIMX/NOPB COUNTRY OF ORIGIN
LM6134BIMX/NOPB PARAMETRIC INFO
LM6134BIMX/NOPB PACKAGE INFO  
LM6134BIMX/NOPB MANUFACTURING INFO
LM6134BIMX/NOPB PACKAGING INFO
LM6134BIMX/NOPB APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Manufacturer Type Low Power Amplifier
Type Low Power Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 1.8
Number of Channels per Chip 4
Minimum PSRR (dB) 78
Typical Single Supply Voltage (V) 3|5|9|12|15|18
Typical Input Resistance (Ohm) 104M
Maximum Single Supply Voltage (V) 24
Minimum Dual Supply Voltage (V) ±0.9
Typical Gain Bandwidth Product (MHz) 10
Maximum Input Offset Voltage (mV) 6@5V
Typical Dual Supply Voltage (V) ±3|±5|±9
Maximum Input Offset Current (uA) 0.03@5V
Maximum Dual Supply Voltage (V) ±12
Maximum Operating Supply Voltage (V) ±12|24
Maximum Input Bias Current (uA) 0.18@5V
Minimum CMRR (dB) 60
Maximum Supply Voltage Range (V) 17 to 30
Minimum CMRR Range (dB) 60 to 65
Typical Voltage Gain (dB) 100
Typical Slew Rate (V/us) 14@5V
Minimum Slew Rate (V/us) 8@5V
Typical Input Offset Current (uA) 0.0034@5V
Typical Output Current (mA) 25(Max)
Typical Input Noise Voltage Density (nV/rtHz) 27@5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.18@5V
Typical Input Bias Current (uA) 0.11@5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single|Dual
Maximum Supply Current (mA) 1.6@5V
Input Offset Voltage Drift (uV/°C) 5(Typ)
 

PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 14
Lead Shape Gull-wing
PCB 14
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 8.75(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 8.75(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AB
Package Outline Link to Datasheet
 

MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
 

PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 2500
Packaging Document Link to Datasheet
 

APPLICATIONS
• Battery Operated Instrumentation
• Instrumentation Amplifiers
• Portable Scanners
• Wireless Communications
• Flat Panel Display Driver


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