LP8860BQVFPRQ1 Texas Instruments IC LED DRIVER 4CH 32HLQFP

label:

2023/08/23 406

• Qualified for Automotive Applications

• AEC-Q100 Qualified With the Following Results:
• Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature

• Input Voltage Operating Range 3 V to 48 V

• Four High-Precision Current Sinks
• Current Matching 0.5% (typical)
• LED String Current up to 150 mA per Channel
• Dimming Ratio > 13 000:1 With External PWM Brightness Control
• 16-bit Dimming Control with SPI or I 2C
• Supports Display Mode (Global Dimming) and Cluster Mode (Independent Dimming)

• Hybrid PWM and Current Dimming for Higher LED Drive Optical Efficiency

• Synchronization for LED PWM Frequency

• Boost Controller With Programmable Switching Frequency 100 kHz to 2.2 MHz and SpreadSpectrum Option for Lower EMI

• Boost Synchronization Input

• Power-Line FET Control for Inrush Current Protection and Standby Energy Saving

• Automatic LED Current Reduction With External Temperature Sensor

• Extensive Fault Diagnostics

CATALOG

LP8860BQVFPRQ1 COUNTRY OF ORIGIN

LP8860BQVFPRQ1 PARAMETRIC INFO

LP8860BQVFPRQ1 PACKAGE INFO

LP8860BQVFPRQ1 MANUFACTURING INFO

LP8860BQVFPRQ1 PACKAGING INFO

LP8860BQVFPRQ1 APPLICATIONS

COUNTRY OF ORIGIN

Taiwan (Province of China)

PARAMETRIC INFO

Number of Segments	32
Minimum Operating Supply Voltage (V)	3
Typical Operating Supply Voltage (V)	3.3\|5\|9\|12\|15\|18\|24
Maximum Operating Supply Voltage (V)	48
Maximum Supply Current (uA)	15000
Output Voltage (V)	2 to 48
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Operating Supply Voltage (V)	3 to 48
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65
Maximum Output Current (mA)	150

PACKAGE INFO

Supplier Package	HLQFP EP
Basic Package Type	Lead-Frame SMT
Pin Count	32
Lead Shape	Gull-wing
PCB	32
Tab	N/R
Pin Pitch (mm)	0.8
Package Length (mm)	7.2(Max)
Package Width (mm)	7.2(Max)
Package Height (mm)	1.45(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	9.2(Max)
Package Overall Width (mm)	9.2(Max)
Package Overall Height (mm)	1.6(Max)
Seated Plane Height (mm)	1.6(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Heat Sinked Low Profile Quad Flat Package
Package Family Name	QFP
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	2
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy
Number of Wave Cycles	N/R

PACKAGING INFO

Packaging	Tape and Reel
Quantity Of Packaging	1000

APPLICATIONS

• Backlight for:
• Automotive Infotainment
• Automotive Instrument Clusters
• Smart Mirrors
• Heads-Up Displays (HUD)
• Central Information Displays (CID)
• Audio-Video Navigation (AVN)