LSM6DSMTR STMicroelectronics IMU ACCEL/GYRO I2C/SPI 14LGA

label:
2023/10/9 394



• “Always-on” experience with low power consumption for both accelerometer and gyroscope
• Power consumption: 0.4 mA in combo normal mode and 0.65 mA in combo high-performance mode
• Smart FIFO up to 4 kbyte based on features set
• Android M compliant
• Auxiliary SPI for OIS data output for gyroscope and accelerometer
• Hard, soft ironing for external magnetic sensor corrections
• ±2/±4/±8/±16 g full scale


CATALOG
LSM6DSMTR COUNTRY OF ORIGIN
LSM6DSMTR PARAMETRIC INFO
LSM6DSMTR PACKAGE INFO
LSM6DSMTR MANUFACTURING INFO
LSM6DSMTR PACKAGING INFO
LSM6DSMTR ECAD MODELS
LSM6DSMTR APPLICATIONS


COUNTRY OF ORIGIN
China
France
Italy
Philippines
Taiwan (Province of China)
Thailand


PARAMETRIC INFO
Combined Sensors Accelerometer/Gyroscope
Axis Type 6-Axis
Minimum Operating Supply Voltage (V) 1.71
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Module/IC Classification IC
Accelerometer Range (g) ±2|±4|±8|±16
Gyroscope Range (°/sec) ±125|±250|±500|±1000|±2000
Interface Type I2C/SPI


PACKAGE INFO
Supplier Package LGA
Basic Package Type Non-Lead-Frame SMT
Pin Count 14
Lead Shape No Lead
PCB 14
Tab N/R
Package Length (mm) 3
Package Width (mm) 2.5
Package Height (mm) 0.86
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Land Grid Array Package
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Ni
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years

PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Reel Diameter (in) 13(Max)
Reel Width (mm) 12.4
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• Motion tracking and gesture detection
• Sensor hub
• Indoor navigation
• IoT and connected devices
• Smart power saving for handheld devices
• EIS and OIS for camera applications
• Vibration monitoring and compensation
Продукт RFQ