
|
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• “Always-on” experience with low power consumption for both accelerometer and gyroscope
|
• Power consumption: 0.4 mA in combo normal mode
and 0.65 mA in combo high-performance mode
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• Smart FIFO up to 4 kbyte based on features set
|
• Android M compliant
|
• Auxiliary SPI for OIS data output for gyroscope and
accelerometer
|
• Hard, soft ironing for external magnetic sensor
corrections
|
• ±2/±4/±8/±16 g full scale
|
|
CATALOG |
LSM6DSMTR COUNTRY OF ORIGIN |
LSM6DSMTR PARAMETRIC INFO
|
LSM6DSMTR PACKAGE INFO
|
LSM6DSMTR MANUFACTURING INFO
|
LSM6DSMTR PACKAGING INFO
|
LSM6DSMTR ECAD MODELS
|
LSM6DSMTR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China |
France
|
Italy
|
Philippines
|
Taiwan (Province of China)
|
Thailand
|
|
PARAMETRIC INFO
|
Combined Sensors |
Accelerometer/Gyroscope |
Axis Type |
6-Axis |
Minimum Operating Supply Voltage (V) |
1.71 |
Maximum Operating Supply Voltage (V) |
3.6 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Module/IC Classification |
IC |
Accelerometer Range (g) |
±2|±4|±8|±16 |
Gyroscope Range (°/sec) |
±125|±250|±500|±1000|±2000 |
Interface Type |
I2C/SPI |
|
|
PACKAGE INFO
|
Supplier Package |
LGA |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
14 |
Lead Shape |
No Lead |
PCB |
14 |
Tab |
N/R |
Package Length (mm) |
3 |
Package Width (mm) |
2.5 |
Package Height (mm) |
0.86 |
Package Diameter (mm) |
N/R |
Mounting |
Surface Mount |
Package Description |
Land Grid Array Package |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Number of Reflow Cycle |
3 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Ni |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
2 Years |
|
|
PACKAGING INFO
|
Packaging Suffix |
TR |
Packaging |
Tape and Reel |
Reel Diameter (in) |
13(Max) |
Reel Width (mm) |
12.4 |
Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|

|
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APPLICATIONS
|
• Motion tracking and gesture detection
|
• Sensor hub
|
• Indoor navigation
|
• IoT and connected devices
|
• Smart power saving for handheld devices
|
• EIS and OIS for camera applications
|
• Vibration monitoring and compensation
|
|