
|
|
• Ultra Broad Bandwidth: 50 MHz to 50 GHz
|
• Functional Bandwidth: 50 MHz to 70 GHz
|
• Insertion Loss: 0.7 dB
|
• Isolation: 33 dB @ 50 GHz
|
• Low Current Consumption:
-10 mA for Low Loss State
+10 mA for Isolation State
|
• MACOMs Unique AlGaAs Hetero-Junction Anode
Technology
|
• Silicon Nitride Passivation
|
• Polymer Scratch Protection
|
• RoHS Compliant
|
|
CATALOG |
MA4AGSW2 PARAMETRIC INFO
|
MA4AGSW2 PACKAGE INFO
|
MA4AGSW2 MANUFACTURING INFO
|
MA4AGSW2 PACKAGING INFO
|
MA4AGSW2 APPLICATIONS
|
|
PARAMETRIC INFO
|
Switch Type |
SPDT |
Number of Switches |
1 |
Switch Configuration |
Single SPDT |
Frequency Band (MHz) |
50 to 50000 |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
125 |
Maximum Insertion Loss (dB) |
0.9 |
Maximum Frequency (MHz) |
50000 |
Technology |
AlGaAs |
Switching Speed (ns) |
20(Typ) |
Minimum Isolation Voltage (dB) |
28 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
Supplier Package |
Chip |
Basic Package Type |
N/A |
Pin Count |
3 |
Lead Shape |
N/A |
PCB |
3 |
Tab |
N/R |
Pin Pitch (mm) |
N/R |
Package Length (mm) |
1.25 |
Package Width (mm) |
0.78 |
Package Height (mm) |
0.1 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
N/R |
Mounting |
N/R |
Package Weight (g) |
N/A |
Package Material |
N/A |
Package Description |
An Unpackaged, Fully Tested Integrated Circuit Chip |
Package Family Name |
N/A |
Jedec |
N/A |
|
|
MANUFACTURING INFO
|
MSL |
N/R |
Maximum Reflow Temperature (°C) |
N/R |
Reflow Solder Time (Sec) |
N/R |
Number of Reflow Cycle |
N/R |
Standard |
N/R |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
N/A |
Under Plating Material |
N/A |
Terminal Base Material |
N/A |
Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
Packaging |
Waffle |
Packaging Document |
Link to Datasheet |
|
|
APPLICATIONS
|
• Aerospace & Defense
|
• ISM
|
|
|