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• Ultra Broad Bandwidth: 50 MHz to 50 GHz
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• Insertion Loss: 0.7 dB
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• Isolation: 31 dB @ 50 GHz
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• Low Current Consumption:
-10 mA for Low Loss State
+10 mA for Isolation State
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• MACOMs Unique AlGaAs Hetero-Junction Anode
Technology
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• Silicon Nitride Passivation
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• Internal Short-Circuit Current Limit
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• Mirror Image Insertion Protection
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• Polymer Scratch Protection
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• RoHS* Compliant
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CATALOG |
MA4AGSW4 PARAMETRIC INFO
|
MA4AGSW4 PACKAGE INFO
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MA4AGSW4 MANUFACTURING INFO
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MA4AGSW4 PACKAGING INFO
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MA4AGSW4 APPLICATIONS
|
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PARAMETRIC INFO
|
Type |
Switch |
Configuration |
Octal |
Maximum Reverse Voltage (V) |
25 |
Frequency Range |
VHF|UHF|SHF|EHF |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
150 |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
125 |
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|
PACKAGE INFO
|
Supplier Package |
Chip |
Basic Package Type |
N/A |
Pin Count |
5 |
Lead Shape |
N/A |
PCB |
5 |
Tab |
N/R |
Pin Pitch (mm) |
N/R |
Package Length (mm) |
1.7 |
Package Width (mm) |
1.52 |
Package Height (mm) |
0.1 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
0.1 |
Mounting |
N/R |
Package Weight (g) |
N/A |
Package Material |
N/A |
Package Description |
An Unpackaged, Fully Tested Integrated Circuit Chip |
Package Family Name |
N/A |
Jedec |
N/A |
|
|
MANUFACTURING INFO
|
MSL |
N/R |
Maximum Reflow Temperature (°C) |
N/A |
Reflow Solder Time (Sec) |
N/A |
Number of Reflow Cycle |
N/A |
Standard |
N/A |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/A |
Wave Solder Time (Sec) |
N/A |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
N/A |
Under Plating Material |
N/A |
Terminal Base Material |
N/A |
Number of Wave Cycles |
N/A |
|
|
PACKAGING INFO
|
Packaging |
Waffle |
Packaging Document |
Link to Datasheet |
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APPLICATIONS
|
• Aerospace & Defense
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• ISM |
|
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