MAAL-010528-TR0500 MACOM IC RF AMP GPS 8GHZ-12GHZ 16QFN

2024/09/12 173

• 1.6 dB Noise Figure

• Single 4 V Bias @ 60 mA

• Fully Internally Matched to 50 Ω

• Lead-Free 3 mm 16-Lead PQFN Package

• Halogen-Free “Green” Mold Compound

• RoHS* Compliant

CATALOG

Manufacturer Type	Low Noise Amplifier
Number of Channels per Chip	1
Typical Power Gain (dB)	20@12000MHz
Typical Noise Figure (dB)	2.1@12000MHz
Typical Output 1dB Compressed Power @ Bias Conditions (dBm)	14
Typical 3rd Order Output Intercept Point @ Bias Conditions (dBm)	26
Typical Output Intercept Point (dBm)	26@12000MHz
Minimum Operating Frequency (MHz)	8000
Maximum Operating Frequency (MHz)	12000
Typical Output Power (dBm)	14@12000MHz
Typical Output Power Range (dBm)	10 to 15
Maximum Input Return Loss (dB)	10(Typ)@12000MHz
Maximum Output Return Loss (dB)	13(Typ)@12000MHz
Power Supply Type	Single
Typical Single Supply Voltage (V)	4
Maximum Single Supply Voltage (V)	6
Maximum Operating Supply Voltage (V)	6
Maximum Supply Current (mA)	75@4V
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

Supplier Package	QFN EP
Basic Package Type	Non-Lead-Frame SMT
Pin Count	16
Lead Shape	No Lead
PCB	16
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	3
Package Width (mm)	3
Package Height (mm)	0.95(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	3
Package Overall Width (mm)	3
Package Overall Height (mm)	0.9
Seated Plane Height (mm)	0.9
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Quad Flat No Lead Package, Exposed Pad
Package Family Name	QFN
Jedec	MO-220VEED-6
Package Outline	Link to Datasheet

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn
Under Plating Material	Cu
Terminal Base Material	N/A
Number of Wave Cycles	N/R