MAX630EPA+ Analog Devices / Maxim Integrated IC REG BOOST ADJ 525MA 8DIP

label:
2023/09/27 488



■ High Efficiency—85% (typ)
■ 70µA Typical Operating Current
■ 1µA Maximum Quiescent Current
■ 2.0V to 16.5V Operation
■ 525mA (Peak) Onboard Drive Capability


CATALOG
MAX630EPA+ COUNTRY OF ORIGIN
MAX630EPA+ PARAMETRIC INFO
MAX630EPA+ PACKAGE INFO
MAX630EPA+ MANUFACTURING INFO
MAX630EPA+ PACKAGING INFO
MAX630EPA+ ECAD MODELS


COUNTRY OF ORIGIN
Philippines
Thailand


PARAMETRIC INFO
Type Step Up
Number of Outputs 1
Minimum Input Voltage (V) 2
Maximum Input Voltage (V) 16.5
Output Voltage (V) 18(Max)
Maximum Output Power (W) 5
Maximum Output Current (A) 0.15
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Extended
Switching Frequency (kHz) 75
Efficiency (%) 85(Typ)
Switching Regulator Yes
Operating Supply Voltage (V) 2 to 16.5
Output Type Adjustable
Load Regulation 0.5%Vo
Line Regulation 0.2%Vo
Typical Quiescent Current (uA) 1(Max)
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 160


PACKAGE INFO
Supplier Package PDIP N
Basic Package Type Through Hole
Pin Count 8
Lead Shape Through Hole
PCB 8
Tab N/R
Pin Pitch (mm) 2.54
Package Length (mm) 9.91(Max)
Package Width (mm) 7.87(Max)
Package Height (mm) 4.45(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 4.57(Max)
Mounting Through Hole
Package Weight (g) N/A
Package Material Plastic
Package Description Plastic Dual In Line Package Narrow Body
Package Family Name DIP
Jedec MS-001AB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/A
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu 194
Number of Wave Cycles N/A


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 50


ECAD MODELS


Продукт RFQ