MAX6675ISA+T Analog Devices / Maxim Integrated IC THERMOCOUP TO DGTL 8-SOIC

label:
2025/03/14 55
MAX6675ISA+T Analog Devices / Maxim Integrated IC THERMOCOUP TO DGTL 8-SOIC


CATALOG
MAX6675ISA+T COUNTRY OF ORIGIN
MAX6675ISA+T PARAMETRIC INFO
MAX6675ISA+T PACKAGE INFO
MAX6675ISA+T MANUFACTURING INFO
MAX6675ISA+T PACKAGING INFO
MAX6675ISA+T ECAD MODELS


COUNTRY OF ORIGIN
Thailand
Malaysia
Philippines


PARAMETRIC INFO
Sensor Type Thermocouple to Digital Converter
Input Type Thermocouple (K)
Output Type Digital
Interface Type SPI
ADC Resolution (bit) 12
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 5.5
Typical Supply Current (mA) 0.7
Minimum Operating Temperature (°C) -20
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Supplier Temperature Grade Industrial
Temperature Flag Opr
Process Technology BiCMOS


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 4.9
Package Width (mm) 3.9
Package Height (mm) 1.37
Package Diameter (mm) N/R
Package Overall Length (mm) 4.9
Package Overall Width (mm) 6
Package Overall Height (mm) 1.55
Seated Plane Height (mm) 1.55
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu 194
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ