|
|
• 10MHz Serial Interface
|
• Individual LED Segment Control
|
• Decode/No-Decode Digit Selection
|
• 150μA Low-Power Shutdown (Data Retained)
|
• Digital and Analog Brightness Control
|
| • Display Blanked on Power-Up |
| • Drive Common-Cathode LED Display |
| • Slew-Rate Limited Segment Drivers
for Lower EMI (MAX7221) |
|
| CATALOG |
MAX7219CWG+T COUNTRY OF ORIGIN
|
MAX7219CWG+T PARAMETRIC INFO
|
MAX7219CWG+T PACKAGE INFO
|
MAX7219CWG+T MANUFACTURING INFO
|
MAX7219CWG+T PACKAGING INFO
|
MAX7219CWG+T ECAD MODELS
|
MAX7219CWG+T APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
Philippines
|
|
PARAMETRIC INFO
|
| Number of Segments |
64 |
| Number of Digits |
8 |
| Minimum Operating Supply Voltage (V) |
4 |
| Typical Operating Supply Voltage (V) |
5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Supply Current (uA) |
330000(Typ) |
| Maximum Power Dissipation (mW) |
941 |
| Low Level Output Current (uA) |
5000(Min) |
| High Level Output Current (uA) |
-2000(Min) |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
70 |
| Supplier Temperature Grade |
Commercial |
| Operating Supply Voltage (V) |
4 to 5.5 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC W |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
Gull-wing |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
15.6(Max) |
| Package Width (mm) |
7.6(Max) |
| Package Height (mm) |
2.35(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
15.6(Max) |
| Package Overall Width (mm) |
10.65(Max) |
| Package Overall Height (mm) |
2.65(Max) |
| Seated Plane Height (mm) |
2.65(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Wide Body |
| Package Family Name |
SO |
| Jedec |
MS-013AD |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu C194 |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
24 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Bar-Graph Displays
|
| • Industrial Controllers |
• Panel Meters
|
• LED Matrix Displays
|
|
| |
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