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• Guardring for Stress Protection
|
• Low Forward Voltage
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• 175°C Operating Junction Temperature
|
| • Epoxy Meets UL 94 V−0
|
| • Package Designed for Optimal Automated Board Assembly |
| • ESD Ratings: Machine Model, C
Human Body Model, 3B |
| • NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable |
| • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant |
|
| CATALOG |
| MBR1H100SFT3G COUNTRY OF ORIGIN |
MBR1H100SFT3G PARAMETRIC INFO
|
MBR1H100SFT3G PACKAGE INFO
|
MBR1H100SFT3G MANUFACTURING INFO
|
MBR1H100SFT3G PACKAGING INFO
|
MBR1H100SFT3G ECAD MODELS
|
|
| COUNTRY OF ORIGIN |
| China |
| Malaysia |
|
PARAMETRIC INFO
|
| Type |
Schottky Diode |
| Configuration |
Single |
| Peak Reverse Repetitive Voltage (V) |
100 |
| Maximum DC Reverse Voltage (V) |
100 |
| Material |
Si |
| Maximum Continuous Forward Current (A) |
1 |
| Maximum Junction Ambient Thermal Resistance |
330°C/W |
| Peak Forward Voltage (V) |
0.84@2A |
| Peak Non-Repetitive Surge Current (A) |
50 |
| Peak Reverse Current (uA) |
40 |
| Operating Junction Temperature (°C) |
-65 to 175 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
175 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
175 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOD-123FL |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
Flat |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
2.7 |
| Package Width (mm) |
1.65 |
| Package Height (mm) |
0.9 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.6 |
| Package Overall Width (mm) |
1.65 |
| Package Overall Height (mm) |
0.95 |
| Seated Plane Height (mm) |
0.95 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Diode Package |
| Package Family Name |
SOD |
| Jedec |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T3 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
10000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4(Min) |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
|
ECAD MODELS
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