MBRS240LT3G onsemi DIODE SCHOTTKY 40V 2A SMB

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2024/08/6 149
MBRS240LT3G onsemi 	DIODE SCHOTTKY 40V 2A SMB


• Compact Package with J−Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guard−Ring for Overvoltage Protection
• Low Forward Voltage Drop
• ESD Ratings:♦ Human Body Model = 3B (> 16000 V)♦ Machine Model = C (> 400 V)
• NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable*
• These are Pb−Free Devices


CATALOG
MBRS240LT3G COUNTRY OF ORIGIN
MBRS240LT3G PARAMETRIC INFO
MBRS240LT3G PACKAGE INFO
MBRS240LT3G MANUFACTURING INFO
MBRS240LT3G PACKAGING INFO
MBRS240LT3G ECAD MODELS


COUNTRY OF ORIGIN
Malaysia
China
Viet Nam


PARAMETRIC INFO
Type Schottky Diode
Configuration Single
Material Si
Maximum DC Reverse Voltage (V) 40
Peak Reverse Repetitive Voltage (V) 40
Maximum Continuous Forward Current (A) 2
Process Technology Bipolar
Maximum Junction Ambient Thermal Resistance 78°C/W
Peak Forward Voltage (V) 0.54@4A
Peak Non-Repetitive Surge Current (A) 25
Peak Reverse Current (uA) 2000
Operating Junction Temperature (°C) -55 to 150
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package SMB
Basic Package Type Lead-Frame SMT
Pin Count 2
Lead Shape J-Lead
PCB 2
Tab N/R
Pin Pitch (mm) N/R
Package Length (mm) 4.32
Package Width (mm) 3.56
Package Height (mm) 2.2
Package Diameter (mm) N/R
Package Overall Length (mm) 5.44
Package Overall Width (mm) 3.56
Package Overall Height (mm) 2.3
Seated Plane Height (mm) 2.3
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description SMD Plastic Package
Package Family Name DO
Jedec DO-214AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix T3
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 12.4(Min)
Tape Pitch (mm) 8
Tape Width (mm) 12
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Anode Opposing Sprocket Hole
Packaging Document Link to Datasheet
Tape Type Embossed


ECAD MODELS


Продукт RFQ