MCF5213CAF66 NXP Semiconductors IC MCU 32BIT 256KB FLASH 100LQFP

2024/05/30 279

CATALOG

Malaysia

Family Name	MCF521x
Data Bus Width (bit)	32
Device Core	ColdFire
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	66
Program Memory Type	Flash
Program Memory Size	256KB
RAM Size	32KB
Maximum Expanded Memory Size	4GB
Maximum CPU Frequency (MHz)	66
Number of Programmable I/Os	55
Number of Timers	4
ADC Channels	8/8
ADC Resolution (bit)	10/10
Core Architecture	ColdFire
Number of ADCs	Single
PWM	1
Watchdog	1
Parallel Master Port	No
Real Time Clock	Yes
Interface Type	CAN/SPI/I2S/TWI/USART/USB
Programmability	Yes
SPI	1
I2C	0
I2S	1
UART	0
USART	1
CAN	1
USB	1
Ethernet	0
Minimum Operating Supply Voltage (V)	3
Typical Operating Supply Voltage (V)	3.3
Maximum Operating Supply Voltage (V)	3.6
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Temperature Flag	Opr
Operating Supply Voltage (V)	3.3
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

Supplier Package	LQFP
Basic Package Type	Lead-Frame SMT
Pin Count	100
Lead Shape	Gull-wing
PCB	100
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	14
Package Width (mm)	14
Package Height (mm)	1.5(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	16
Package Overall Width (mm)	16
Package Overall Height (mm)	1.7(Max)
Seated Plane Height (mm)	1.7(Max)
Mounting	Surface Mount
Package Weight (g)	0.6852
Package Material	Plastic
Package Description	Low Profile Quad Flat Package
Package Family Name	QFP
Package Outline	Link to Datasheet

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	40
Number of Reflow Cycle	3
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	Cu Alloy