MCIMX6Q5EYM10AD NXP Semiconductors IC MPU I.MX6Q 1.0GHZ 624FCBGA

label:
2024/06/6 302




CATALOG
MCIMX6Q5EYM10AD COUNTRY OF ORIGIN
MCIMX6Q5EYM10AD PARAMETRIC INFO
MCIMX6Q5EYM10AD PACKAGE INFO
MCIMX6Q5EYM10AD MANUFACTURING INFO
MCIMX6Q5EYM10AD PACKAGING INFO
MCIMX6Q5EYM10AD EACD MODELS



COUNTRY OF ORIGIN
Malaysia



PARAMETRIC INFO
Tradename i.MX
Data Bus Width (bit) 32
Family Name i.MX 6Quad
Device Core ARM Cortex A9
Maximum Clock Rate (MHz) 1000
Program Memory Type ROM
Program Memory Size 96KB
RAM Size 272KB
Maximum Speed (MHz) 1000
Number of Timers 3
Processing Unit Microprocessor
Process Technology 40nm
Application Netbooks/High-end mobile Internet devices/Gaming consoles
Core Architecture ARM
Type Applications Processor
PWM 4
Ethernet Speed 10Mbps/100Mbps/1000Mbps
Watchdog 2
Interface Type CAN/Ethernet/I2C/I2S/SPI/UART/USB
USART 0
Ethernet 1
I2C 3
I2S 3
SPI 5
UART 5
Data Cache Size 32KB
USB 4
CAN 2
Instruction Cache Size 32KB
Display Interface LCD
Programmability Yes
PCI 1
Minimum Operating Supply Voltage (V) 1.65
Typical Operating Supply Voltage (V) 1.8|2.8|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -20
Maximum Operating Temperature (°C) 105
Temperature Flag Jun
Supplier Temperature Grade Extended
External Memory Interface DDR2 SDRAM|DDR3 SDRAM|LPDDR2 SDRAM|NOR Flash|PSRAM|Celluler RAM|SLC NAND Flash|MLC NAND Flash
Minimum Storage Temperature (°C) -40
Maximum Storage Temperature (°C) 150



PACKAGE INFO
Supplier Package FCBGA
Basic Package Type Ball Grid Array
Pin Count 624
Lead Shape Ball
PCB 624
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 21
Package Width (mm) 21
Package Height (mm) 1.05
Package Diameter (mm) N/R
Package Overall Length (mm) 21
Package Overall Width (mm) 21
Package Overall Height (mm) 1.45
Seated Plane Height (mm) 1.45
Mounting Surface Mount
Package Weight (g) 1.2871
Package Material Plastic
Package Description Flip Chip Ball Grid Array
Package Family Name BGA
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 40
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/A



PACKAGING INFO
Packaging Tray
Quantity Of Packaging 60
Packaging Document Link to Datasheet



ECAD MODELS


Продукт RFQ