MKE02Z32VLC4R NXP Semiconductors KINETIS KE02: 40MHZ CORTEX-M0+ 5

label:

2024/02/1 278

• Operating characteristics
– Voltage range: 2.7 to 5.5 V
– Flash write voltage range: 2.7 to 5.5 V
– Temperature range (ambient): -40 to 105°C

• Performance
– Up to 40 MHz Arm® Cortex-M0+ core and up to 20MHz bus clock
– Single cycle 32-bit x 32-bit multiplier
– Single cycle I/O access port

• Memories and memory interfaces
– Up to 64 KB flash
– Up to 256 B EEPROM
– Up to 4 KB RAM

• Clocks
– Oscillator (OSC) - supports 32.768 kHz crystal or 4MHz to 20 MHz crystal or ceramic resonator; choiceof low power or high gain oscillators
– Internal clock source (ICS) - internal FLL withinternal or external reference, 31.25 kHz pretrimmed internal reference for 32 MHz system clock(able to be trimmed for up to 40 MHz system clock)
– Internal 1 kHz low-power oscillator (LPO)

• System peripherals
– Power management module (PMC) with three powermodes: Run, Wait, Stop
– Low-voltage detection (LVD) with reset or interrupt,selectable trip points
– Watchdog with independent clock source (WDOG)
– Programmable cyclic redundancy check module(CRC)
– Serial wire debug interface (SWD)
– Bit manipulation engine (BME)

• Security and integrity modules
– 64-bit unique identification (ID) number per chip

• Human-machine interface
– Up to 57 general-purpose input/output (GPIO)
– Two up to 8-bit keyboard interrupt modules (KBI)
– External interrupt (IRQ)

• Analog modules
– One up to 16-channel 12-bit SAR ADC, operation inStop mode, optional hardware trigger (ADC)
– Two analog comparators containing a 6-bit DACand programmable reference input (ACMP)

• Timers
– One 6-channel FlexTimer/PWM (FTM)
– Two 2-channel FlexTimer/PWM (FTM)
– One 2-channel periodic interrupt timer (PIT)
– One real-time clock (RTC)

• Communication interfaces
– Two SPI modules (SPI)
– Up to three UART modules (UART)
– One I2C module (I2C)

• Package options
– 64-pin QFP/LQFP
– 44-pin LQFP
– 32-pin LQFP
– 32-pin QFN

CATALOG

MKE02Z32VLC4R COUNTRY OF ORIGIN

MKE02Z32VLC4R PARAMETRIC INFO

MKE02Z32VLC4R PACKAGE INFO

MKE02Z32VLC4R MANUFACTURING INFO

MKE02Z32VLC4R PACKAGING INFO

COUNTRY OF ORIGIN

Malaysia

Taiwan (Province of China)

Philippines

China

PARAMETRIC INFO

Data Bus Width (bit)	32
Family Name	KE02
Device Core	ARM Cortex M0+
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	40
Program Memory Type	Flash
Program Memory Size	32KB
RAM Size	4KB
Maximum CPU Frequency (MHz)	40
EEPROM	256B
Direct Memory Access	No
Floating Point Unit	No
Bluetooth	No
Wi-Fi	No
Multiply Accumulate	No
Internal/External Clock Type	External
Touch Sensing Interface	No
Power On Reset	No
Memory Protection Unit	No
Temperature Sensor	No
DDR	No
Memory Management Unit	No
Integrated Development Environment	No
Super Scalar	No
External Bus Interface	No
Number of Programmable I/Os	28
Number of Timers	4
ADC Channels	16
DAC Channels	2
ADC Resolution (bit)	12
Number of ADCs	Single
Core Architecture	ARM
Number of DACs	Single
DAC Resolution (bit)	6
PWM	2
Watchdog	1
Analog Comparators	2
Parallel Master Port	No
Real Time Clock	Yes
Interface Type	I2C/SPI/UART
Programmability	Yes
SPI	2
I2C	1
I2S	0
UART	3
USART	0
CAN	0
USB	0
Ethernet	0
Minimum Operating Supply Voltage (V)	2.7
Typical Operating Supply Voltage (V)	3.3\|5
Maximum Operating Supply Voltage (V)	5.5
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	105
Temperature Flag	Opr
Supplier Temperature Grade	Commercial
Operating Supply Voltage (V)	3.3\|5
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-55

PACKAGE INFO

Supplier Package	LQFP
Basic Package Type	Lead-Frame SMT
Pin Count	32
Lead Shape	Gull-wing
PCB	32
Tab	N/R
Pin Pitch (mm)	0.8
Package Length (mm)	7
Package Width (mm)	7
Package Height (mm)	1.45(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	9
Package Overall Width (mm)	9
Package Overall Height (mm)	1.6(Max)
Seated Plane Height (mm)	1.6(Max)
Mounting	Surface Mount
Package Weight (g)	0.1886
Package Material	Plastic
Package Description	Low Profile Quad Flat Package
Package Family Name	QFP
Jedec	MS-026BBA
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	40
Number of Reflow Cycle	3
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Sn
Under Plating Material	N/A
Terminal Base Material	Cu Alloy

PACKAGING INFO

Packaging Suffix	R
Packaging	Tape and Reel
Quantity Of Packaging	2000