MKE02Z64VLC4 NXP Semiconductors IC MCU 32BIT 64KB FLASH 32LQFP

label:
2023/10/10 317



CATALOG
MKE02Z64VLC4 COUNTRY OF ORIGIN
MKE02Z64VLC4 PARAMETRIC INFO
MKE02Z64VLC4 PACKAGE INFO
MKE02Z64VLC4 MANUFACTURING INFO
MKE02Z64VLC4 PACKAGING INFO
MKE02Z64VLC4 ECAD MODELS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Data Bus Width (bit) 32
Family Name KE02
Device Core ARM Cortex M0+
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 40
Program Memory Type Flash
Program Memory Size 64KB
RAM Size 4KB
EEPROM 256B
Direct Memory Access No
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Internal/External Clock Type External
Touch Sensing Interface No
Power On Reset No
Memory Protection Unit No
Temperature Sensor No
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Maximum CPU Frequency (MHz) 40
Number of Programmable I/Os 28
Number of Timers 4
ADC Channels 16
ADC Resolution (bit) 12
DAC Channels 2
Core Architecture ARM
Number of ADCs Single
DAC Resolution (bit) 6
Number of DACs Single
PWM 2
Watchdog 1
Analog Comparators 2
Parallel Master Port No
Real Time Clock Yes
Interface Type I2C/SPI/UART
Programmability Yes
SPI 2
I2C 1
I2S 0
UART 3
USART 0
CAN 0
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Temperature Flag Opr
Supplier Temperature Grade Commercial
Operating Supply Voltage (V) 3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -55


PACKAGE INFO
Supplier Package LQFP
Basic Package Type Lead-Frame SMT
Pin Count 32
Lead Shape Gull-wing
PCB 32
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 7
Package Width (mm) 7
Package Height (mm) 1.45(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 9
Package Overall Width (mm) 9
Package Overall Height (mm) 1.6(Max)
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Weight (g) 0.1886
Package Material Plastic
Package Description Low Profile Quad Flat Package
Package Family Name QFP
Jedec MS-026BBA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 40
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 250(Min)
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ