MM5Z3V0T1G onsemi DIODE ZENER 3V 500MW SOD523

label:
2024/05/6 235

• Standard Zener Breakdown Voltage Range − 2.4 V to 75 V
• Standard Tolerance Series
• Steady State Power Rating of 500 mW
• Small Body Outline Dimensions:0.047″ x 0.032″ (1.20 mm x 0.80 mm)Low Body Height: 0.028″ (0.7 mm)
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant*



CATALOG
MM5Z3V0T1G COUNTRY OF ORIGIN
MM5Z3V0T1G PARAMETRIC INFO
MM5Z3V0T1G PACKAGE INFO
MM5Z3V0T1G MANUFACTURING INFO
MM5Z3V0T1G PACKAGING INFO
MM5Z3V0T1G EACD MODELS



COUNTRY OF ORIGIN
China



PARAMETRIC INFO
Type Voltage Regulator
Configuration Single
Nominal Zener Voltage (V) 3
Maximum Reverse Leakage Current (uA) 10
Maximum Zener Impedance (Ohm) 100
Maximum Power Dissipation (mW) 500
Maximum Power Dissipation @ 25C (mW) 500
Typical Voltage Temperature Coefficient -1.75mV/K
Test Current (mA) 5
Maximum Zener Voltage (V) 3.2
Minimum Zener Voltage (V) 2.8
Maximum Forward Voltage (V) 0.9
Maximum Diode Capacitance (pF) 450
Zener Voltage Tolerance 7%
Minimum Operating Temperature (°C) -65
Maximum Operating Temperature (°C) 150



PACKAGE INFO
Supplier Package SOD-523
Basic Package Type Lead-Frame SMT
Pin Count 2
Lead Shape Flat
PCB 2
Tab N/R
Pin Pitch (mm) N/R
Package Length (mm) 1.2
Package Width (mm) 0.8
Package Height (mm) 0.6
Package Diameter (mm) N/R
Package Overall Length (mm) 1.6
Package Overall Width (mm) 0.8
Package Overall Height (mm) 0.6
Seated Plane Height (mm) 0.6
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Diode Package
Package Family Name SOD
Jedec SOD-523
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material FeNi Alloy



PACKAGING INFO
Packaging Suffix T1
Packaging Tape and Reel
Quantity Of Packaging 3000
Packaging Document Link to Datasheet

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