MMBF170LT1G onsemi MOSFET N-CH 60V 500MA SOT-23

label:
2024/08/21 168
MMBF170LT1G onsemi MOSFET N-CH 60V 500MA SOT-23


• NVBF Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant


CATALOG
MMBF170LT1G COUNTRY OF ORIGIN
MMBF170LT1G PARAMETRIC INFO
MMBF170LT1G PACKAGE INFO
MMBF170LT1G MANUFACTURING INFO
MMBF170LT1G PACKAGING INFO
MMBF170LT1G ECAD MODELS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Topology Shunt
Reference Type Adjustable
Output Voltage (V) 2.5 to 36
Initial Accuracy 0.5%
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
Maximum Input Voltage (V) 37
Maximum Output Current (mA) 15
Maximum Temperature Coefficient 66ppm/°C


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 3
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3.04(Max)
Package Width (mm) 1.4(Max)
Package Height (mm) 0.95
Package Diameter (mm) N/R
Package Overall Length (mm) 3.04(Max)
Package Overall Width (mm) 2.64(Max)
Package Overall Height (mm) 1.12(Max)
Seated Plane Height (mm) 1.12(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-236
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 4
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn|Au
Under Plating Material N/A|Pd over Ni
Terminal Base Material N/A|Cu Alloy
Number of Wave Cycles N/A


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Reel Width (mm) 9|9.2
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q3
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ