MMBT5551-7-F Diodes Incorporated TRANS NPN 160V 0.6A SOT23-3

label:
2024/06/28 178

• BVCEO > 160V
• Ideal for Low Power Amplification and Switching
• Complementary PNP Type Available (MMBT5401)
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• An automotive-compliant part is available under separate datasheet (MMBT5551Q)
CATALOG
MMBT5551-7-F COUNTRY OF ORIGIN
MMBT5551-7-F PARAMETRIC INFO
MMBT5551-7-F PACKAGE INFO
MMBT5551-7-F MANUFACTURING INFO
MMBT5551-7-F PACKAGING INFO
MMBT5551-7-F EACD MODELS



COUNTRY OF ORIGIN
China



PARAMETRIC INFO
Type NPN
Configuration Single
Maximum Collector-Emitter Voltage (V) 160
Maximum Collector Base Voltage (V) 180
Maximum Emitter Base Voltage (V) 6
Maximum DC Collector Current (A) 0.6
Minimum Transition Frequency (MHz) 100
Maximum Power Dissipation (mW) 300
Collector Current for VCE Saturation (mA) 10|50
Maximum Noise Figure (dB) 8
Maximum Emitter Cut-Off Current (nA) 50
Maximum Junction Ambient Thermal Resistance 417°C/W
Typical Output Capacitance (pF) 6(Max)
Operating Junction Temperature (°C) -55 to 150
Maximum Collector Cut-Off Current (nA) 50
Maximum Collector-Emitter Saturation Voltage (V) 0.15@1mA@10mA|0.2@5mA@50mA
Maximum Base Emitter Saturation Voltage (V) 1@1mA@10mA|1@5mA@50mA
Category Bipolar Small Signal
Minimum DC Current Gain 80@1mA@5V|80@10mA@5V|30@50mA@5V
Number of Elements per Chip 1
Maximum Transition Frequency (MHz) 300
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150



PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 3
Tab N/R
Pin Pitch (mm) 0.92
Package Length (mm) 2.9
Package Width (mm) 1.3
Package Height (mm) 0.98
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.4
Package Overall Height (mm) 1.03
Seated Plane Height (mm) 1.03
Mounting Surface Mount
Package Weight (g) 0.008
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-236AB
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H 1
Minimum PACKAGE_DIMENSION_H 0.89
Maximum PACKAGE_DIMENSION_L 3
Minimum PACKAGE_DIMENSION_L 2.8
Maximum PACKAGE_DIMENSION_W 1.4
Minimum PACKAGE_DIMENSION_W 1.2
Maximum Diameter N/R
Minimum Diameter N/R
Maximum Seated_Plane_Height 1.1
Minimum Seated_Plane_Height 0.9



MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Alloy 42
Number of Wave Cycles N/R



PACKAGING INFO
Packaging Suffix 7
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Reel Width (mm) 8.4
Tape Pitch (mm) 4
Tape Width (mm) 8
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Single Pin At Sprocket Hole
Packaging Document Link to Datasheet
Tape Type Embossed



ECAD MODELS



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